3D IC stacking technology
Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editor (McGraw-Hill, 2011)
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| Collection Type : | Buku Teks |
| Call Number : | 621.381 53 THR |
| Additional entry-Personal name : | |
| Subject : | |
| Publishing : | New York: McGraw-Hill, 2011 |
| Language Code | eng |
| Edition | first edition |
| Place | New York |
| Cataloguing Source | LibUI eng rda |
| Content Type | text |
| Media Type | unmediated |
| Carrier Type | volume |
| Physical Description | xviii, 521 pages : illustration ; 23 cm |
| Holding Institution | Universitas Indonesia |
| Location | Perpustakaan UI, Lantai 2 |
| Call Number | Barcode Number | Availability |
|---|---|---|
| 621.381 53 THR | 01-13-0570 | TERSEDIA |
| Review: |
| No review available for this collection: 20353033 |
