Contents : - Recent Developments in Weldability Testing for Advanced Materials - Reactive Air Brazing for High-Temperature Electrochemical Applications - The Effect of High-Temperature Dual Reducing/Oxidizing Gas Conditions on Silver-Based Filler Metal Compositions - Development of Hyper-Interfacial Bonding Process of Ultra-Fine Grained High Strength Steels - Important Lessons Learnt in the Design of Consumables for Welding High Strength Steels - The Development of a Compressive Residual Stress Around a Structural Steel Weld by Means of Phase Transformations - Micro Electron Beam Welding in an SEM - Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and it’s Corrosion Resistance - The Effect of Surface Tension on Microjoining - Interfacial Reaction Between Sn-8Zn-3Bi and Ni/Au Plating - Room Temperature Lead-Free Soldering of Microelectronic Components using a Local Heat Source - Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder and Au/Ni-Co Plating - Microstructural Characterization of Eutectic Sn-Au Solder as a Lead-free Solution - Effects of Melt-Pool Geometry and Substrate Orientation on Microstructure Development in Laser Surface Melting of Single Crystal Superalloys - Weldability of Ni-Base Single Crystal Superalloys - Microstructure of Laser Deposited Superalloy RENE 80 on GTD-111 - Designing Sealing Glasses for Solid Oxide Fuel Cells - Glass-Ceramics for Sealing Solid Oxide Fuel Cells - Compressive Mica Seals for Solid Oxide Fuel Cells - High Temperature Seals for Solid Oxide Fuel Cells (SOFC) - A New Sealing Concept for Planar Solid Oxide Fuel Cells - Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd: YAG Laser Irradiation - Damage Control of Soldering Iron Tip for Lead-Free Solder - Resistance Microwelding of Fine Nickel Wires - Novel Bonding Process Using Ag Nanoparticles - Influence of Bonding Conditions - - YAG Laser and TIG Arc Hybrid Welding Phenomena - Effect of Joint Design on Mechanical Properties of AL7075 Weldment - Properties of Weld Joints of Bake-Hardening Steel for Automobile - Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University- Industry Design Project Collaboration - Effect of Ni Addition on Interfacial Reaction between Sn-Cu Solder and Cu Base Metal - Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn- Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu land