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Joining of advanced and specialty materials VII: proceedings from materials solutions 2004 on joining of advanced and specialty materials, October 18–20, 2004 columbus, Ohio

(ASM International, 2005)

 Abstrak

Contents :
- Recent Developments in Weldability Testing for Advanced Materials
- Reactive Air Brazing for High-Temperature Electrochemical Applications
- The Effect of High-Temperature Dual Reducing/Oxidizing Gas Conditions on
Silver-Based Filler Metal Compositions
- Development of Hyper-Interfacial Bonding Process of Ultra-Fine Grained High
Strength Steels
- Important Lessons Learnt in the Design of Consumables for Welding High
Strength Steels
- The Development of a Compressive Residual Stress Around a Structural Steel
Weld by Means of Phase Transformations
- Micro Electron Beam Welding in an SEM
- Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and it’s
Corrosion Resistance
- The Effect of Surface Tension on Microjoining
- Interfacial Reaction Between Sn-8Zn-3Bi and Ni/Au Plating
- Room Temperature Lead-Free Soldering of Microelectronic Components using a
Local Heat Source
- Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder
and Au/Ni-Co Plating
- Microstructural Characterization of Eutectic Sn-Au Solder as a Lead-free Solution
- Effects of Melt-Pool Geometry and Substrate Orientation on Microstructure
Development in Laser Surface Melting of Single Crystal Superalloys
- Weldability of Ni-Base Single Crystal Superalloys
- Microstructure of Laser Deposited Superalloy RENE 80 on GTD-111
- Designing Sealing Glasses for Solid Oxide Fuel Cells
- Glass-Ceramics for Sealing Solid Oxide Fuel Cells
- Compressive Mica Seals for Solid Oxide Fuel Cells
- High Temperature Seals for Solid Oxide Fuel Cells (SOFC)
- A New Sealing Concept for Planar Solid Oxide Fuel Cells
- Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd:
YAG Laser Irradiation
- Damage Control of Soldering Iron Tip for Lead-Free Solder
- Resistance Microwelding of Fine Nickel Wires
- Novel Bonding Process Using Ag Nanoparticles - Influence of Bonding
Conditions -
- YAG Laser and TIG Arc Hybrid Welding Phenomena
- Effect of Joint Design on Mechanical Properties of AL7075 Weldment
- Properties of Weld Joints of Bake-Hardening Steel for Automobile
- Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University-
Industry Design Project Collaboration
- Effect of Ni Addition on Interfacial Reaction between Sn-Cu Solder and Cu Base
Metal
- Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn-
Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu land

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 Metadata

Jenis Koleksi : eBooks
No. Panggil : e20442560
Subjek :
Penerbitan : Materials Park, Ohio: ASM International, 2005
Sumber Pengatalogan: LibUI eng rda
Tipe Konten: text
Tipe Media: computer
Tipe Pembawa: online resource
Deskripsi Fisik: vii, 218 pages : illustration
Tautan: http://portal.igpublish.com/iglibrary/search/ASMIB0000089.main.html?2
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Lokasi:
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