Contents :- Microelectronics failure analysis desk reference, 2001 supplement - Preface - Microelectronic Failure Analysis Desk Reference 2001 Supplement - FIB Backside Isolation Techniques - The SEM Lab, From Laboratory Logistics to Final Sample Preparation Techniques for SEM Analysis of Semiconductors - Cross Sectioning with a Pivoting Sample Block - Focused Ion Beam Cross Sectioning as a Compliment or an Alternative to Conventional Mechanical Sectioning Techniques - Alternatives to Cross-Sectional Simple Preparation for Package and Board-Level Failure Analysis - Automation To Boost Productivity And Increase Repeatability: (A Sampling of Available Tools and Vendors) - Multi-Functional, Semi-Automatic Sample Preparation for Failure Analysis - SMPT©-Sub-Micron Polishing Technology For Automated Sample Preparation - Automated Techniques For SEM And TEM Sample Preparation - Sample Preparation Techniques for Site-Specific Cross-Sectional Analysis of High-Aspect-Ratio FIB Repair Sites - Deprocessing, Cross-Sectioning and FIB Circuit Modification of Parts Having Copper Metallization - Scanning Capacitance Microscopy of Junction and Non-Junction Samples - Electrical Probing of Deep Sub-Micron Integrated Circuits Using Scanning Probe Techniques - Application of Tunneling Atomic Force Microscopy (TUNA) to Failure Analysis - GoFATA: Glossary of Failure Analysis Tool Acronyms - ISTFA Subject Index