Contents :- Microscopy at the Nanoscale - Polarization Difference Probing: A New Phase Detection Scheme for Laser Voltage Probing - Spray Cooling for Time Resolved Emission Measurements of ICs - A Novel Technique for Detecting High Resistance Fault Using Electroplating - Magnetic Current Imaging Techniques: Comparative Case Studies - Electrical Characterization of sub-30nm Gatelength Soi Mosfets - Combination of SCM/SSRM Analysis and Nanoprobing Technique for Soft Single Bit Failure Analysis - Current Image Atomic Force Microscopy (CI-AFM) Combined with Atomic Force Probing (AFP) for Location and Characterization of Advanced Technology Node. - Towards High Accuracy Fault Diagnosis of Digital Circuits - Broken Scan Chain Diagnostics based on Time-Integrated and Time-Dependent Emission Measurements - Hardware Results Demonstrating Defect Localization Using Power Supply Signal Measurements - Scanning SQUID Microscopy for New Package Technologies - Failure Analysis of Short Faults on Advanced Wire-bond and Flip-chip Packages with Scanning SQUID Microscopy - A Novel Approach to Identifying and Validating Electrical Leakage in Printed Circuit Boards through Magnetic Current Imaging - Extracting Acoustic signatures of Solder Bump Defects using Wavelet Power Spectra and their Classification using Normalized Cross- Correlation. - A Novel X-ray Microtomography System with High Resolution and Throughput For Non-Destructive 3D Imaging of Advanced Packages - Fault Isolation of Large Nets Using Bridging Fault Analysis - Cavity Up and Stack Die Backside Failure Analysis for Thin Die and High Pin Count Devices - Investigation of Substrate Dislocation Induced Bit Line Soft Failure - Overcoming Environmentally Induced Probe Drift for Sub-300nm Fault Isolation - Dislocation Induced Leakage of p+-Implanted ESD Test Macros in 90nm Technology - A Purpose-Driven Decision-Based Methodology for Debug and Failure Analysis - Improved Electrical Failure Analysis / Fault Isolation Tool Development on Server Motherboard Platforms based on Historic Failure Modes - Intel® Component Diagnostic Technology: Tools and Education for Intel Component Defect Reduction - Capacity Management Solutions - A Novel Approach for Enhancing Critical FIB Imaging for Failure Analysis and Circuit Edit Applications - Contacting Silicon with FIB for Backside Circuit Edit - IC Specification Improvement Through Direct Passive Component Modification in the FIB - FIB Chip Repair: Improving Success by Controlling Beam-Induced Damage and Thermal / Mechanical Stress - Precise Fail site Isolation using a combination of Global, Software and Tester based Isolation Techniques - Optimised Probing Flow for High Speed Fault Localization - Diagnostic Fault Simulation for the Failure Analyst - Diagnosing DACS (Defects That Affect Scan Chain and System Logic) - Timing Analysis of a Microprocessor PLL using High Quantum Efficiency Superconducting Single Photon Detector (SSPD) - Analysis of 0.13 um CMOS Technology Using Time Resolved Light Emission - Photon Emission Microscopy in 90 nm CMOS Technologies - Quantifying the Work of Adhesion Between an AFM Cantilever Tip and MEMS Test Structures After Packaging - Reliability of Polycrystalline MEMS : Prediction of the Debugging-time - Failure Analysis of Electrothermal Actuators Subjected to Electrical Overstress (EOS) and Electrostatic Discharge (ESD) - Detecting the 10 Angstroms that Changes MEMS Performance - Scanning Electron Microscope Induced Electrical Breakdown of Tungsten Windows in Integrated Circuit Processing - The Effect Temperature and Strain Rate on Selected Lead Free Solder Alloys - Semiconductor Inter-Material Analysis using a FIB Sample Preparation Method and Auger Depth Profiling - Identification and Characterization of Ultra-thin (<100 nm) Flakes Using a Combination of Face-lapping, High Energy (10 kV) SEM Imaging, and TEM - Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint - Measurement of Solder Joint Strength and its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages Using a Laser Spallation Technique - A Methodology for Characterizing System-Level ESD Sensitivity - Design and Process Related Failure Detection with Reliability Testing Incorporating Varying Power Sequencing and Slew Rate - A Study of Power Plane Shapes, Their Contribution to Inter-Planar Electric Field Intensities, and Pre-Preg Breakdown - Characterization of VCSEL-array Degradation Induced by Elevated Temperature and Humidity - FiberQA-AVIT System