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"The book has numerous line drawings designed especially for the text and a large number of exercises with solutions at the end of each chapter. This 3rd edition is the translation of the seventh German edition with new chapters focused on crystal chemistry and x-ray diffraction methods."

"Material solder saat ini banyak menggunakan Sn-Pb. Saat ini ada permasalahan lingkungan yaitu Pb yang bersifat racun. Selain itu terjadi fenomena Whiskers yang dapat menyebabkan hubungan pendek pada peralatan elektronik. Telah dilakukan sintesa material solder bebastimbal Sn-0.7Cu-xBi/Zn. Pada sampel dilakukan karakterisasi x-ray difraksi. Dilakukan analisis Rietveld untukm emperoleh parameter kristalografidant eksturpa daarah bidang tertentu untuk melihat fenomena whisker. Hasil anilisa Rietveld memperlihatkan penambahan unsurBismut dengan konsentrs i tertentu pada paduan Sn-0.7Cu-xBi dapat merubah teksturpada bidang kristalografi tertentu ditandai dengant ingginya kerapatan pole figure yang dapat diartik antingginya keseragaman orientasikristalit yang dapat menja di penghambat whiskers dibidangtersebut.

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Solder material is using Lead (Pb) recently. Toxity of lead was creating environtment issue now. Beside of that whiskers phenomena could make short at electronics circuits. Synthesis of Sn-0.7Cu-xBi/Zn lead free solder materials have been conducted. These alloys were being characterized by using XRD diffractometer. Crystallographic paratemeters and texture of certain plane have been extracted to observe whiskers phenomena. The result from Rietveld refinement show that adding certain Bismuth concentration could change texture of Sn-0.7Cu-xBi alloy at certain crystall plane. This condition was being show by high density of pole figure, means crystallite orientation more uniform. High density of pole figure at certain crystall plane could become whisker inhibitor."