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"Contents : - Recent Developments in Weldability Testing for Advanced Materials - Reactive Air Brazing for High-Temperature Electrochemical Applications - The Effect of High-Temperature Dual Reducing/Oxidizing Gas Conditions on Silver-Based Filler Metal Compositions - Development of Hyper-Interfacial Bonding Process of Ultra-Fine Grained High Strength Steels - Important Lessons Learnt in the Design of Consumables for Welding High Strength Steels - The Development of a Compressive Residual Stress Around a Structural Steel Weld by Means of Phase Transformations - Micro Electron Beam Welding in an SEM - Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and it’s Corrosion Resistance - The Effect of Surface Tension on Microjoining - Interfacial Reaction Between Sn-8Zn-3Bi and Ni/Au Plating - Room Temperature Lead-Free Soldering of Microelectronic Components using a Local Heat Source - Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder and Au/Ni-Co Plating - Microstructural Characterization of Eutectic Sn-Au Solder as a Lead-free Solution - Effects of Melt-Pool Geometry and Substrate Orientation on Microstructure Development in Laser Surface Melting of Single Crystal Superalloys - Weldability of Ni-Base Single Crystal Superalloys - Microstructure of Laser Deposited Superalloy RENE 80 on GTD-111 - Designing Sealing Glasses for Solid Oxide Fuel Cells - Glass-Ceramics for Sealing Solid Oxide Fuel Cells - Compressive Mica Seals for Solid Oxide Fuel Cells - High Temperature Seals for Solid Oxide Fuel Cells (SOFC) - A New Sealing Concept for Planar Solid Oxide Fuel Cells - Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd: YAG Laser Irradiation - Damage Control of Soldering Iron Tip for Lead-Free Solder - Resistance Microwelding of Fine Nickel Wires - Novel Bonding Process Using Ag Nanoparticles - Influence of Bonding Conditions - - YAG Laser and TIG Arc Hybrid Welding Phenomena - Effect of Joint Design on Mechanical Properties of AL7075 Weldment - Properties of Weld Joints of Bake-Hardening Steel for Automobile - Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University- Industry Design Project Collaboration - Effect of Ni Addition on Interfacial Reaction between Sn-Cu Solder and Cu Base Metal - Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn- Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu land "

"In this proceedings volume, professionals from the medical device industry and their suppliers share technological and scientific knowledge, as well as insights into the latest innovations."

"Priced for clearance sale! Price was $134. Save $109! The overwhelming success of this second Materials and Processes for Medical Devices conference can be attributed to the balanced coverage of medical device technology, new materials, new processes, testing issues, regulatory issues, and specific device application concerns."

"Proceedings from the only conference on medical devices that brings together scientists and product, research, design and development engineers from around the globe to present the latest developments in materials, processes, product performance and new technologies for medical/dental devices.This volume includes contributions from the world?s foremost experts from academia, industry, and national laboratories involved in cardiac, vascular, neurological, and orthopaedic implants, dental devices, and surgical instrumentation/devices.Materials addressed include biomedical alloys (stainless steels, titanium alloys, cobalt-chromium alloys, nickel-titanium alloys, noble and refractory metals) biopolymers, bioceramics, surface coatings, and nanomaterials.Topics covered include: degradation, wear fracture, corrosion, processing, biomimetics, biocompatibility, bioelectric phenomena and electrode behavior, surface engineering, and cell-material interactions."

"This volume includes contributions from the world?s foremost experts from academia, industry, and national laboratories involved in cardiac, vascular, neurological, and orthopaedic implants, dental devices, and surgical instrumentation/devices. Topics covered include: fabrication, fatigue, corrosion, tissue biocompatibility, cell-surface interactions, regulatory issues, shape memory alloys and a host of other cutting edge subjects."