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"Notes"LU, SPPI, Sociālo un politisko pētījumu institūts; Stratēg̓iskās analīzes komisija"--Cover.Includes bibliographical references.Chiefly in English; some contributions in Latvian."

"This book reports on cutting-edge theories and methods for analyzing complex systems, such as transportation and communication networks and discusses multi-disciplinary approaches to dependability problems encountered when dealing with complex systems in practice. The book presents the most noteworthy methods and results discussed at the International Conference on Reliability and Statistics in Transportation and Communication (RelStat), which took place in Riga, Latvia on October 17-20, 2018. It spans a broad spectrum of topics, from mathematical models and design methodologies, to software engineering, data security and financial issues, as well as practical problems in technical systems, such as transportation and telecommunications, and in engineering education."

"This proceedings volume representing the second International Thermal Spray Conference (May 2004, Osaka, Japan) contains 232 papers and 93 poster presentations. Arrangement is in sections on applications, characterization methods for coating properties, coating technologies for vehicle engines, cold spray, consumables for thermal spraying, corrosion protection, economics and quality, HVOF processes and materials, innovative equipment and process technology, modeling and simulation, nanostructured materials, photocatalytic materials, process diagnostics, protective coatings against wear and erosion, and thermal barrier coatings."

"This book constitutes the refereed and revised proceedings of the workshops and the doctoral consortium co-located with the 10th International Conference on Perspectives in Business Informatics Research (BIR), held in Riga, Latvia, in October 2011. The four workshops focused on Information Logistics and Knowledge Supply for Viable Enterprises (ILOG 2011), Alignment of Business Processes and Security Modeling (ABPSM 2011), Intelligent Educational Systems and Technology-Enhanced Learning (INTEL-EDU 2011), and User-Oriented Information Integration (UOII 2011). The two best papers from the doctoral consortium are also included."

"Contents :- Microscopy at the Nanoscale - Polarization Difference Probing: A New Phase Detection Scheme for Laser Voltage Probing - Spray Cooling for Time Resolved Emission Measurements of ICs - A Novel Technique for Detecting High Resistance Fault Using Electroplating - Magnetic Current Imaging Techniques: Comparative Case Studies - Electrical Characterization of sub-30nm Gatelength Soi Mosfets - Combination of SCM/SSRM Analysis and Nanoprobing Technique for Soft Single Bit Failure Analysis - Current Image Atomic Force Microscopy (CI-AFM) Combined with Atomic Force Probing (AFP) for Location and Characterization of Advanced Technology Node. - Towards High Accuracy Fault Diagnosis of Digital Circuits - Broken Scan Chain Diagnostics based on Time-Integrated and Time-Dependent Emission Measurements - Hardware Results Demonstrating Defect Localization Using Power Supply Signal Measurements - Scanning SQUID Microscopy for New Package Technologies - Failure Analysis of Short Faults on Advanced Wire-bond and Flip-chip Packages with Scanning SQUID Microscopy - A Novel Approach to Identifying and Validating Electrical Leakage in Printed Circuit Boards through Magnetic Current Imaging - Extracting Acoustic signatures of Solder Bump Defects using Wavelet Power Spectra and their Classification using Normalized Cross- Correlation. - A Novel X-ray Microtomography System with High Resolution and Throughput For Non-Destructive 3D Imaging of Advanced Packages - Fault Isolation of Large Nets Using Bridging Fault Analysis - Cavity Up and Stack Die Backside Failure Analysis for Thin Die and High Pin Count Devices - Investigation of Substrate Dislocation Induced Bit Line Soft Failure - Overcoming Environmentally Induced Probe Drift for Sub-300nm Fault Isolation - Dislocation Induced Leakage of p+-Implanted ESD Test Macros in 90nm Technology - A Purpose-Driven Decision-Based Methodology for Debug and Failure Analysis - Improved Electrical Failure Analysis / Fault Isolation Tool Development on Server Motherboard Platforms based on Historic Failure Modes - Intel® Component Diagnostic Technology: Tools and Education for Intel Component Defect Reduction - Capacity Management Solutions - A Novel Approach for Enhancing Critical FIB Imaging for Failure Analysis and Circuit Edit Applications - Contacting Silicon with FIB for Backside Circuit Edit - IC Specification Improvement Through Direct Passive Component Modification in the FIB - FIB Chip Repair: Improving Success by Controlling Beam-Induced Damage and Thermal / Mechanical Stress - Precise Fail site Isolation using a combination of Global, Software and Tester based Isolation Techniques - Optimised Probing Flow for High Speed Fault Localization - Diagnostic Fault Simulation for the Failure Analyst - Diagnosing DACS (Defects That Affect Scan Chain and System Logic) - Timing Analysis of a Microprocessor PLL using High Quantum Efficiency Superconducting Single Photon Detector (SSPD) - Analysis of 0.13 um CMOS Technology Using Time Resolved Light Emission - Photon Emission Microscopy in 90 nm CMOS Technologies - Quantifying the Work of Adhesion Between an AFM Cantilever Tip and MEMS Test Structures After Packaging - Reliability of Polycrystalline MEMS : Prediction of the Debugging-time - Failure Analysis of Electrothermal Actuators Subjected to Electrical Overstress (EOS) and Electrostatic Discharge (ESD) - Detecting the 10 Angstroms that Changes MEMS Performance - Scanning Electron Microscope Induced Electrical Breakdown of Tungsten Windows in Integrated Circuit Processing - The Effect Temperature and Strain Rate on Selected Lead Free Solder Alloys - Semiconductor Inter-Material Analysis using a FIB Sample Preparation Method and Auger Depth Profiling - Identification and Characterization of Ultra-thin (<100 nm) Flakes Using a Combination of Face-lapping, High Energy (10 kV) SEM Imaging, and TEM - Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint - Measurement of Solder Joint Strength and its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages Using a Laser Spallation Technique - A Methodology for Characterizing System-Level ESD Sensitivity - Design and Process Related Failure Detection with Reliability Testing Incorporating Varying Power Sequencing and Slew Rate - A Study of Power Plane Shapes, Their Contribution to Inter-Planar Electric Field Intensities, and Pre-Preg Breakdown - Characterization of VCSEL-array Degradation Induced by Elevated Temperature and Humidity - FiberQA-AVIT System "

"The SMST Conferences focus on real-world issues and applications of shape memory materials. This volume includes more than 100 edited technical papers and is an excellent reference on the latest technical advances, industrial applications, and current state of-the-art in shape memory and superelastic technologies."

"This book constitutes the thoroughly refereed post-conference proceedings of the 7th International Conference on Intelligent Computing, ICIC 2011, held in Zhengzhou, China, in August 2011. The 94 revised full papers presented were carefully reviewed and selected from 832 submissions. The papers are organized in topical sections on neural networks, machine learning theory and methods, fuzzy theory and models, fuzzy systems and soft computing, evolutionary learning & genetic algorithms, swarm intelligence and optimization, intelligent computing in computer vision, intelligent computing in image processing, biometrics with applications to individual security/forensic sciences, intelligent image/document retrievals, natural language processing and computational linguistics, intelligent data fusion and information security, intelligent computing in pattern recognition, intelligent agent and web applications, intelligent computing in scheduling, intelligent control and automation."

"This book constitutes the refereed proceedings of the 5th International Conference on Brain Inspired Cognitive Systems, BICS 2012, held in Shenyang, Liaoning, China in July 2012. The 46 high-quality papers presented were carefully reviewed and selected from 116 submissions. The papers are organized in topical sections on biologically inspired systems, cognitive neuroscience, models of consciousness, and neural computation."