Hasil Pencarian  ::  Simpan CSV :: Kembali

"This work presents a unified approach to the vibrations of elastic systems as applied to MEMS devices, mechanical components, and civil structures.Applications include atomic force microscopes, energy harvesters, and carbon nanotubes and consider such complicating effects as squeeze film damping, viscous fluid loading, in-plane forces, and proof mass interactions with their elastic supports. These effects are analyzed as single degree-of-freedom models and as more realistic elastic structures. The governing equations and boundary conditions for beams, plates, and shells with interior and boundary attachments are derived by applying variational calculus to an expression describing the energy of the system. The advantages of this approach regarding the generation of orthogonal functions and the Rayleigh-Ritz method are demonstrated.A large number of graphs and tables are given to show the impact of various factors on the systems’ natural frequencies, mode shapes, and responses."

"This book explores the fabrication of soft material and biomimetic MEMS sensors, presents a review of MEMS/NEMS energy harvesters and self-powered sensors, and focuses on the recent efforts in developing flexible and wearable piezoelectric nanogenerators. It also includes a critical analysis of various energy harvesting principles, such as electromagnetic, piezoelectric, electrostatic, triboelectric, and magnetostrictive. Included are chapters that:- Describe self/low-powered MEMS devices that are developed through biomimetic and bio-inspired approaches;- Review the recent progress in kinetic MEMS/NEMS-enabled energy harvesters as self-powered sensors;- Comprehensively review the ongoing research done in the field of nanofiber-based flexible and wearable energy harvesters;- Explore the current trends in the field of soft materials research and future challenges."

"This book discusses the prevalent practices and enabling techniques in the assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics covered include the bonding and sealing of microcomponents, the process flow of MEMS and microsystem packaging, automated microassembly, and testing and design for testing."