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"Power electronic packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. The book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions."

"Buku yang berjudul "Electronic materials handbook : volume 1 packaging" ini merupakan sebuah buku panduan mengenai material elektronik."

"Tulisan ini ingin melihat bagaimana proses cheapening terjadi di dalam kapitalosen melalui infrastruktur, struktur, dan superstruktur pada sampah dengan kemasan plastik. Rumusan masalah ingin melihat bagaimana proses cheapening terjadi pada masyarakat Komplek Bumi Sawangan Indah Blok H, menjalani kesehariannya dengan plastik, dan mengapa barang FMCG sekali pakai masih digunakan. Metode yang digunakan adalah observasi partisipan dan wawancara. Kesimpulannya dalah bahwa kerusakan alam bukanlah bersifat anthropogenic, melainkan capitalogenic.

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This writing wants to see how the cheapening process occurs in the capitalocene through the infrastructure, structure, and superstructure of goods with plastic packaging. The formulation of the problem wants to see how the cheapening process occurs in the people of the Bumi Sawangan Indah Complex Blok H, living their daily lives with plastic, and why single-use FMCG goods are still used. The methods used are participant observation and interviews. The conclusion is that natural damage is not anthropogenic, but capitalogenic."