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"Contents :
- Recent Developments in the Understanding of Stainless Steel Welding Metallurgy
- Tailoring the Phase Balance During Laser and GTA Keyhole Welding of SAF
2205 Duplex Stainless Steel
- Pitting Corrosion Resistance of Duplex Stainless Steels Multipass Welds
- Investigation of the Kinetics of the Ferrite/Austenite Phase Transformation in the
HAZ of a 2205 Duplex Stainless Steel Weldment
- Effect of GTAW Flux on the Microstructure and Properties of Austenitic, Super
Austenitic and Super Duplex Stainless Steel Welds
- COlumnar-to-Equiaxed Transition During Solidification of Steel Welds
- Analysis of Autogenous Gas Tungsten Arc and Laser Welding of Superaustenitic
Stainless Steels for Naval Combatant Hulls
- Laser Welding of Superaustenitic Stainless Steel
- Prediction of Solidification Mode and Hot Cracking Susceptibility in Laser Welds
of High Nitrogen Stainless Steels
- HAZ Properties of High Nitrogen Austenitic Stainless Steel
- Ductility-Dip Cracking Susceptibility of Austenitic Alloys
- Fatigue Crack Propagation of Stainless Steel Welds
- Hot Cracking Resistance of Laser and Hybrid Welded Austenitic Stainless Steels
- Improved Models for Predicting Ferrite Content in Stainless Steel Welds
- Progress in Joining Austenitic Stainless Steels by Friction Stir Welding
- Effect of Twin-Induced Grain Boundary Engineering on Intergranular Corrosion
in Austenitic Stainless Steel
- Effect of CTE on Fatigue Cracking of Stainless Steel Vessels
- Recent Developments in Transport Phenomena in Fusion Welding
- Laser Weld Keyhole Dynamics
- Computer Modeling of Keyhole Mode Laser Welding to Avoid Macro-porosity
- Dimensionless Relationships for the Keyhole Weld Characteristics in AZ80
Magnesium Alloy
- Numerical Modeling of Stationary GTA Welding
- Validation of Computed Weld Pool Temperature Profiles for GTA Welding of Gamma TiAl
- Anode Heat Transfer in GTA Welding
- A k-E Model for Turbulent Weld Pool Convection in Gas Metal Arc Welding
Process
- Analysis of Friction Stir Weld Using the Inverse-Problem Approach
- Phase Distribution and Transformation Dynamics in Fusion Welds Using In-situ
Synchrotron Diffraction Methods
- Advanced Characterization Techniques for Weld Microstructures
- Nonequilibrium solidification in Fe-C-Al-Mn steel welds
- Mapping Phase Transformations in the Heat-Affected-Zone of Carbon Manganese
Steel Welds Using Spatially Resolved X-Ray Diffraction
- Modeling of Ferrite to Austenite Transformation and Real Time Mapping of
Phases During GTA Welding of 1005 Steel
- Magnetic Force Microscopy as a Tool for Weld Metal Studies
- Characterization of Delta Ferrite Content in GTAW Deposited Stainless Steel
Cladding
- Grain Growth in the Heat-Affected Zone of Ti-6Al-4V Welds: Measurements and
Three Dimensional Monte Carlo Simulation
- Friction Stir Welding Developments
- A Detailed Three-Dimensional Transient Heat Transfer Model For Friction Stir
Welding
- Input Torque Based Thermal Model of Friction Stir Welding of Al-6061
- High-Speed Video Flow Visualization in Friction Stir Welds of Polycarbonate
- Visualization of Material Flow During Friction Stir Welding (FSW) of the Same and
Dissimilar Aluminum Alloys
- Force Sensing in Friction Stir Welding
- Microstructural Analysis and Modeling of the Heat Affected Zone in Al 2519
Friction Stir Welds
- Thermo-Mechanicat Anatyses of Wetding Atuminium Alloy with TIG and Friction Stir Welding
- Residual Stress Distributions in Friction Stir Welded Al Sheets Determined by Neutron Strain Scanning
- Effect of Pin Tool Shape on Metal Flow During Friction Stir Welding
- Reproduction of Ultra-Fine Grains in Equal Channel Angular Pressed Al Alloy
by Friction Stir Process
- Improvement of Mechanical Properties in Thixomolded Mg Alloy AZ91D by
Friction Stir Welding
- The Evaluation of the Mechanical Properties of AA5083 Friction Stir Welds by
Electronic Speckle Pattern Interferometry
- Investigating Post-Weld Heat Treatments to Increase the Corrosion and the
Environmental Cracking Behavior of 7075-T6 Friction Stir Weld
- Pitting Corrosion Behavior of Friction Stir Welded 7050-T74 Aluminum Alloy
- The Effect of the Welding Conditions on the Nugget Zone in Friction Stir Welds in
an AA7010 Alloy
- Metallurgical Characterization of Friction Stir Welded 7050-T74 and C458-T3
Aluminum Alloys
- Weld Efficiency and Defect Formation: Correlation Between Experiment and
Simple Models
- Low Plasticity Burnishing of Friction Stir Welds in 2219 Aluminum to Increase
Corrosion Fatigue Life
- Mechanical Property and Microstructural Evaluation of Friction Stir Welded AL-
6XN
- Post-Weld Aging of Friction Stir Wel"
Materials Park, Ohio: ASM International, 2003
e20442612
eBooks  Universitas Indonesia Library
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"The Trends conference attracts the world?s leading welding researchers. Topics covered in this volume include friction stir welding, sensing, control and automation, microstructure and properties, welding processes, procedures and consumables, weldability, modeling, phase transformations, residual stress and distortion, physical processes in welding, and properties and structural integrity of weldments."
Materials Park, Ohio: ASM International, 2009
e20451745
eBooks  Universitas Indonesia Library
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"The many papers presented in this volume present an integrated approach to welding disciplines. Discussion included the basic sciences of physics, chemistry, and mathematics, along with computer science and mechanical and electrical engineering. Features extensive coverage of friction stir welding technology advances."
Materials Park, Ohio: ASM International, 2006
e20451833
eBooks  Universitas Indonesia Library
cover
"Contents :
- IPFA 2002 Best Paper Award Winner
- SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of
Electronic Devices
- From Microns to Molecules–Can FA Remain Viable Through the Next Decade?
- Soft Defect Localization (SDL) on ICs
- Fault Localization and Functional Testing of ICs by Lock-in Thermography
- Visualisation of Electrically Active Areas Using Electron Holography
- A Study of Photoelectron Emission Microscopy Contrast Mechanisms Relevant to
Microelectronics
- Application of Acoustic Fourier Domain Imaging for the Evaluation of Advanced
Micro Electronic Packages
- Orientation Imaging Microscopy Applications in Cu-Interconnects and Cu-Cu Wire
Bonding
- Materials Analysis and Process Monitoring in MegaFabs
- STEM (Scanning Transmission Electron Microscopy) in a SEM (Scanning
Electron Microscope) for Failure Analysis and Metrology
- Microcalorimeter Energy Dispersive X-Ray Spectroscopy in Routine
Semiconductor Failure Analysis
- A Working Method for Adapting the (SEM) Scanning Electron Microscope to
Produce (STEM) Scanning Transmission Electron Microscope Images
- Applications of EELS to Semiconductor Devices Failure Analysis by Using a 300
keV TEM
- Laser Milling Methods for Package Failure Analysis
- Laser Decapsulation of Transfer Molded Plastic Packages for Failure Analysis
- Investigation of Microstructure Change on Ni-based UBM Systems in Lead Free
Solder
- Failure Analysis Strategy For 2 Stacked Die CSP
- Evaluation of Package Defects by Thermal Imaging Techniques
- Backside Hot Spot Detection
- Optimizing Backside Image Quality
- Infrared Microthermography for Integrated Circuit Fault Location; Sensitivity and
Limitations
- Failure Analysis of Tungsten Contact Failure in a 0.13 um CMOS Process
- Backside Photoemission and Infrared Microthermography for Rapid Debug of
Compound Semiconductor Devices
- Laser-Voltage-Prober Measurements on Bipolar Devices
- Application of Focused Ion Beam in Debug and Characterization of 0.13 um
Copper Interconnect Technology
- Thin-Die Flip Chip Physical-FA Process Flow
- Failure Mechanism and Rootcause Analysis of UBGA Solder Ball Contamination
- Passivation Damage and Residue-Induced Package Failure Analysis For a 16
Lead SOIC GaAs RF/IF Package
- Study on a Single NFET Degradation After Circuit Modification with FIB
- New Techniques to Improve the Efficiency of TEM Sample Preparation
- A Transmission X-Ray Microscope (TXM) for Non-Destructive 3D Imaging of ICs
at Sub-100 nm Resolution
- A Broadband Model for Ultrasonic Pulses in the Presence of Thin Layers in
Microelectronics
- Beam-Based Localization Techniques for 0.18 um IC Failure Analysis after
Reliability Test
- Methodologies for Isolating Faults in Multi Chip Fiber Optic Transceivers that Use
GHz Mixed Signal ICs
- Application of Various Fault Localization Techniques to Different Types of 6T-
SRAM column Failures
- Missing Metal Pillar Failure Analysis-A Plug Technology Issue
- Reliability and failure analysis of RF MEMS switches
- Failure Analysis of Polysilicon Micromirror Arrays
- Failure Analysis of the Digital Micromirror Device
- Wavefront Coded Imaging Systems for MEMS Analysis
- Sample preparation for Vertical Transistors in DRAM
- A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens
Prepared by FIB
- CMOS Backside Deprocessing With TMAH/IPA as a Sample Preparation
Procedure for Failure Analysis
- Investigation of Choline Hydroxide for Selective Silicon Etch from a Gate Oxide
Failure Analysis Standpoint
- In situ Decapsulation of Plastic Encapsulated Devices Mounted to a Printed
Circuit Board
- A Standardized Scientific Method Formulation for Failure Analysis Application
- Probeless FA Approach: a Breakthrough Simulation Based Failure Analysis
Method
- Electrical Faults Captured by In-Line E-beam Inspection and Failure Analysis
- Effect of Corner Underfill Voids on Chip Scale Package (CSP) Performance
Under Mechanical Loading
- Leakage Isolation of Mixed-Signal Devices at Operating Modes
- Method for Measuring Package to Board Interconnection Shear Strength for Area
Array, Fine Pitch Packages
- Picosecond Imaging Circuit Analysis of Leakage Currents in CMOS Circuits
- Scanning SQUID Microscopy for Die Level Fault Isolation
- A Successful Failure Localization Approach for Defect Identification on High
Resistance Interconnects
- Backside FIB Device Modifications Through the BOX Layer of an SOI Device
- Coax"
Materials Park, Ohio: ASM International, 2002
e20442621
eBooks  Universitas Indonesia Library
cover
David Pointcheval, editor
"This book constitutes the refereed proceedings of the 31st Annual International Conference on the Theory and Applications of Cryptographic Techniques, EUROCRYPT 2012, held in Cambgridge, UK, in April 2012.
The 41 papers, presented together with 2 invited talks, were carefully reviewed and selected from 195 submissions. The papers are organized in topical sections on index calculus, symmetric constructions, secure computation, protocols, lossy trapdoor functions, tools, symmetric cryptanalysis, fully homomorphic encryption, asymmetric cryptanalysis, efficient reductions, public-key schemes, security models, and lattices."
Berlin: Springer-Verlag, 2012
e20406359
eBooks  Universitas Indonesia Library
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Jakarta: University Indonesia, 2003
621STUI001
Multimedia  Universitas Indonesia Library
cover
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"The growth in the bioinformatics and computational biology fields over the last few years has been remarkable. The analysis of the datasets of next generation sequencing needs new algorithms and approaches from fields such as databases, statistics, Data mining, machine learning, optimization, computer science and artificial intelligence. Also systems biology has also been emerging as an alternative to the reductionist view that dominated biological research in the last decades. This book presents the results of the 6th International Conference on Practical Applications of Computational Biology & Bioinformatics held at University of Salamanca, Spain, 28-30th March, 2012 which brought together interdisciplinary scientists that have a strong background in the biological and computational sciences."
Berlin : Springer, 2012
e20397719
eBooks  Universitas Indonesia Library
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