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"Perpindahan panas merupakan suatu proses atau fenomena untuk menghasilkan energi panas, dan proses perturakan energi panas. Fenomena perpindahan panas ini sering kali terjadi pada industri – industri proses manufaktur. Perpindahan panas biasa terjadi secara konduksi. Konduksi adalah perpindahan panas yang membutuhkan medium atau perantara dan tanpa disertai dengan perpindahan perantara yang ada. Konduksi biasa terjadi pada beragam jenis material atau perantara, bisa berfasa padat, cair, maupun gas. Perpindahan panas bisa diketahui dengan pengukuran konduktivitas termal. Pengukuran ini biasa dilakukan dengan alat ukur tertentu seperti thermometer dan termokopel. Dalam penelitian kali ini, pengukuran dilakukan menggunakan temperature data logger dan dihubungkan dengan cooling box peltier. Material yang digunakan adalah besi untuk fasa padat dan untuk fasa cair digunakan aquades dengan variasi yang berbeda-beda. Penurunan temperatur selama 30 detik akan menjadi acuan dan setelah didapatkan nilainya, kemudian akan diolah untuk mendapatkan nilai kl serta kesalahan relatif nya.

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Heat transfer is a process or phenomenon of heat energy production, and heat energy exchange processes. Heat transfer phenomena often occur in the manufacturing process industry. Heat transfer usually occurs by conduction. Conduction is a heat transfer that requires medium without transfer the intermediate medium. Conduction can occurs in a variety of materials and media, can be liqud, solid, even gas. Heat transfers can be determined by measuring thermal conductivity, in this research measurements were done by using a temperature data logger connected to a peltier cooling box. The material used in the measurement is iron for solid phase and aquadest as a liquid phase. A temperature drop of 30 seconds will be the reference and after the value is obtained, it will be processed to obtain the value of kl and relative error.

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"This authoritative reference presents a comprehensive review of the evolution of plasma science and technology fundamentals over the past five decades. One of this field’s principal challenges has been its multidisciplinary nature requiring coverage of fundamental plasma physics in plasma generation, transport phenomena under high-temperature conditions, involving momentum, heat and mass transfer, and high-temperature reaction kinetics, as well as fundamentals of material science under extreme conditions. The book is structured in five distinct parts, which are presented in a reader-friendly format allowing for detailed coverage of the science base and engineering aspects of the technology including plasma generation, mathematical modeling, diagnostics, and industrial applications of thermal plasma technology. This book is an essential resource for practicing engineers, research scientists, and graduate students working in the field."

"This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena."

"Setelah pioner schimiah dkk (1930) memunculkan hasil penelitiannya mengenai kondensasi tetes,mulailah tema tsb dikembangkan oleh para peneliti lainnya. Kondensasi tetes menhhasilkan nilai koefesien perpindahan panas lebih baik dibandingkan kondensasi film. Tujuan dr studi ini adalah mempelajari karakteritik dr proses kondensasi yg terjadi pd permukaan kondenser yg dilapisioleh lapisan tipis teflon. Kondensor yg dilapisi oleh lapisan emas ,teflon, & campuran tembaga dengan bron diukur kemampuan perpindahan panasnya.Uap air mengalir melalui pipa-pipa kondenser yg didinginkan oleh air menghasilkan kondensasi film & atau tetes. Kondenser yg dilapisi oleh teflon menghasilkan koefesien perpindahan kalor yg lebih tinggi dibanding yg lainnya & membuktikan kondensasi tetes lebih baik."