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"ABSTRAKThis article is part of my master's thesis which titled identity politics and capitalism in Illegal Logging along Indonesia - MAlaysia Border. In this article, i try to explain how the state, through its coercive and repressive apparatus, attempted to control its citizens or to create "forced-compliance" citizens against its claim of legitimacy within the phenomena of the politics of natural resource management, particulary in the incidence of illegal logging along the Indonesia-Malaysia border. To serve this purpose, a field research with a qualitative approach was carried out in kabupaten of Kapuas Hulu particulary in kecamatan Badau wich is next to Malaysian border.The state believes that with its coercive power and repressive apparatus it has been successful in forcing its citizens to comply with forest management regulations. It is true when the compliance is analyzed under the assumption that people are active and creative; the state existance, tith its coercive and repressive apparatus, will be interupted, negitiated and redefined both by its people and business enterprises to strengthen their bargaining positions within the power relation, that is state vis a vis people or business enterprises.In the phenomena of illegal logging any change in the coerciva apparatus and repressive state by its agencies or institutions will always be swindled by any segment of the society dealing with them. therefore, any situation and policy taken by the state to stop the practice of illegal logging always be followed by new strategies in doing the unlawfully practice. One of the causes which allows the discovery of new tactics is that the deregulation of forest management has created confusions among the actors which in turn has allowed the execution of new strategies in illegal logging."

"Coupled drives apparatus adalah suatu sistem multivariabel yang dirancang untuk menunjukkan pengendalian kecepatan motor dan tension material. Sistem ini, dengan penggerak yang saling berinteraksi, banyak digunakan dalam aplikasi industri. Coupled drives apparatus mempakan sistem dengan dua masukan dan dua keluaran. Masukannya berupa dua buah motor DC, sedangkan keluarannya berupa kecepatan dan rension. Dalam tesis ini, dilakukan perancangan pengendali optimal kuadratik dan pra kompensator dengan menggunakan model-model diskrit, yang didapat dari respon lingkar terbuka sistem (kecepatan dan tension). Pengujian hasil perancangan sistem pengendali dilakukan dengan simulasi menggunakan program Matlab - Simulink dan memberikan hasil yang baik.

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Coupled drives apparatus is a multivariable system designed to demonstrate how to control motor speed and material tension. This system, with an interacting drives, is used in many industrial application. Coupled drives apparatus is a two input - two output (TITO) system. The inputs are two dc motors, and the outputs are speed and tension. In this thesis, we design this system with quadratic optimal controller and pre compensator based on discrete models, which get from open loop speed and tension response. The result from controller system design tested with simulation using Matlab - Simulink, and the result is good."

"Pengeringan vakum merupakan salah satu teknik pengeringan yang sudah dikenal orang. Tetapi tidak sernua pihak yang telah memanfaatkan teknlk pengeringan seperti ini mengetahui perhitungan-perhitungan yang mendasari proses yang terjadi di dalamnya, Apalagi kondisi lingkungan yang komplek dan mudah berubah memerlukan penanganan berbeda dalam mengoptimalkan perfonna pengering vakum tersebut. Untuk itu diperlukan sebuah program yang dapat menunjukkan dengan cepat performa pengering vakum dengan kondisi yang berbeda beda. Simulasi pengering vakum ini merupakan sebuah program yang berisi persamaan persamaan yang yang mendasari proses yang terjadi pada pengering vakum yang skema dasamya telah dibuat terlebih dahulu. sehingga untuk pengering vakum ynng rnemiliki-skema berbeda diperlukan perubahan sebagai penyesuaian. Dalam menggunakan program pengering vakum ini, dibutuhkan nilat tekanan, temperatur bola kering dan temperatur bo!a basah udara luar serta laju penguapan yang diinginkan sebagai input. Sedangkan output berupa sifat termodinamika udara keluaran dan daya pompa vakum yang dibutuhkan pengering tersebut. kesalahan literatur yang terjadi pada persamaan sifat termodinamika udara pad a program ini tidak melebihi nilai 3 %.......Vacuum dryer is one of drying technique that has been known. Calculations that are used in the technique are not known by almost who use this technique, Complex and unstable conditions need different approximation to optimize this performance, A program that can show vacuum dryer performance in different conditions has been built. The program is based on equations that are used in vacuum dryer process in which we built the scheme for another scheme. we can change the approximation. Pressure, dry bulb temperature, wet bulb temperature and evaporation rate are needed for the input. We obtain air thermodynamic properties and power of vacuum pump. In the study we obtain error Jess then 3 %."

"This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results."

"Untuk memenuhi Sustainable Development Goals PBB no.13 yaitu mengambil tindakan untuk mengatasi permasalahan perubahan iklim, salah satu hal yang harus diatasi adalah emisi gas karbon dioksida. Di antara banyak metode, yang paling umum digunakan adalah penjerapan CO2 dengan menggunakan absorben. Dalam penelitian mencari absorben yang paling ramah lingkungan, Deep Eutectic Solvent (DES) ditemukan sebagai alternatif pengganti teknologi penyerapan CO2 konvensional dan ILs. Sebelumnya, dibuat seperangkat alat untuk uji absorpsi CO2 oleh DES di Lab RPKA, Departemen Teknik Kimia, Universitas Indonesia. Akan tetapi, kapasitas absorpsi CO2 yang dihasilkan relatif lebih rendah dibandingkan dengan penelitian sejenis. Penelitian ini bertujuan untuk meningkatkan hasil tersebut dengan melakukan modifikasi alat. Pada penelitian ini, DES yang terbentuk dari kombinasi antara Carvacrol dan 1-Naphthol dengan rasio molar 9:1 menghasilkan kapasitas absorpsi CO2 yang tertinggi pada tekanan 7,06 bar dengan fraksi mol CO2 0,46 mol CO2/mol DES, dimana pada penelitian sebelumnya dihasilkan 0,0090 mol CO2/mol DES pada tekanan 7,88 bar. Oleh karena itu, penambahan stirring dalam uji absorpsi terbukti memperbesar permukaan absorpsi CO2 sehingga meningkatkan perpindahan masssa molekul CO2.......To fulfil the United Nations Sustainable Development Goals no.13, which is taking actions to combat climate change, one of the most important things to do is to solve the carbon dioxide gas emission. One of the most used methods is CO2 capture by using absorbent. In the research to find the most “green” absorbent, Deep Eutectic Solvent (DES) is discovered as an alternative to the conventional CO2 capture technology and ILs. Previously, an apparatus set is made in the RPKA laboratory, Chemical Engineering Department, Universitas Indonesia, to test CO2 absorption by DES. However, the CO2 absorption capacity is still lower than in similar research. This research aims to improve the result by modifying the apparatus set. The DES combination of Carvacrol and 1-Naphthol with a 9:1 molar ratio in this research results in the highest CO2 absorption capacity under 7.06 bars pressure with CO2 mole fraction of 0.46 mol CO2/mol DES, while the previous research results in 0.0090 mol CO2/mol DES under 7.88 bars pressure. Therefore, adding stirring while doing the absorption test is proven to enlarge the CO2 absorption surface and thus boost the mass transfer of CO2 molecules."

"ABSTRAKPraktik kerja profesi di Direktorat Jenderal Kefarmasian dan Alat Kesehatan Kementerian Kesehatan Republik Indonesia Periode 9-20 Oktober 2017 bertujuan untuk memahami tugas dan tanggung jawab apoteker di lembaga pemerintahan, memiliki wawasan, pengetahuan, keterampilan dan pengalaman praktis untuk melakukan praktek kefarmasian di lembaga pemerintahan, memiliki gambaran nyata tentang permasalahan praktek kefarmasian di lembaga pemerintahan, khususnya di Direktorat Penilaian Alat Kesehatan dan Perbekalan Kesehatan Rumah Tangga. Praktik kerja profesi di Direktorat Jenderal Kefarmasian dan Alat Kesehatan Kementerian Kesehatan Republik Indonesia dilakukan selama empat minggu dengan tugas khusus yaitu Evaluasi Pelaksanaan Pengurusan Izin Edar Alat Kesehatan Diagnostik HIV Tahun 2015-2017. Tujuan dari tugas khusus ini untuk mengetahui permasalahan yang terjadi pada proses pendaftaran izin edar alat kesehatan diagnostik in vitro untuk HIV pada tahun 2015 hingga 2017

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ABSTRACTInternship at at the Directorate General of Pharmaceutical and Medical Devices Ministry of Health Republic of Indonesia Period 9-20 October 2017 aims to understand the duties and responsibilities of pharmacists in government institutions, having the insight, knowledge, skills and practical experience of pharmaceutical practice in government institutions, can also have the insight of pharmaceutical practice issues in government institutions, especially in the Directorate of Health Apparatus and Household Health Supplies Assessment. The Internship in the Directorate General of Pharmaceutical and Medical Devices of the Ministry of Health of the Republic of Indonesia was conducted for two weeks with a special task Evaluation of the Registration Process of HIV Diagnostic Medical Devices 2015-2017. The purpose of the specific task is to find out problems in the process of enrollment for HIV health for HIV by 2015 to 2017"

"Contents :- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging Techniques in CMOS Failure Analysis - Infrared Light Emission From Semiconductor Devices - The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI Circuits - Golden Devices II: Alchemy in the 0.35 um Era - Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip - Two Unique Case Studies Performed With Photoemission Microscopy (PEM) - Application of Photoemission Microscopy and Focused Ion Beam Microsurgery to an Investigation of Latchup - Localizing Heat-Generating Defects Using Fluorescent Microthermal Imaging - A User-Friendly System for Fluorescent Microthermal Imaging and Light Emission Microscopy - Fast, Clean and Low Damage Deprocessing Using Inductively Coupled and RIE Plasmas - X-Ray Microfocus Radioscopy and Computed Tomography for Failure Analysis - Low Resistivity FIB Depositions Within High Aspect Ratio Holes - Grains Observation Using FIB Anisotropic Etch Followed by AFM Imaging - Cross-Sectional Specimen Preparation of Fragile Failure Location in Thin-Film Transistors Using Focused Ion Beam Etching and Transmission Electron Microscope - Low Acceleration Voltage EBIC Using FESEM and Application to Cross- Sectional Junction Evaluation - Contamination Diagnosis Using Contamination-Defect-Fault (CDF) Simulation - FLOSPAT: Fault Localization by Sensitized Path Transformation - Fault Verification Simulation for Light-Emission Microscopy and Liquid-Crystal Analysis - Fault Diagnosis on the TMS320C80 (MVP) Using FastScanTM - Modeling IC Defects Using Circuit Simulation Software - Characterization of Unfilled Tungsten Plugs on a 0.35 um CMOS Multilevel Metallization Process - Failure Analysis of a Half-Micron CMOS IC Technology - Burn-in Failure Analysis of 0.5 um 1 MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug - The Application of Novel Failure Analysis Techniques and Defect Modeling in Eliminating Short Poly End-Cap Problem in Submicron CMOS Devices - Case Study: Unique Stress Induced Gate Oxide Defects in a CMOS Analog/Digital Device Revealed by Backside Silicon Removal - Risk Assessment in Signature Analysis - Signature Analysis: Statistical Models and Their Application to FA - A Signature Analysis Method for IC Failure Analysis - TEM Sample Preparation Using A Focused Ion Beam and A Probe Manipulator - Pin-Point Transmission Electron Microscopic Analysis Applied to Off-Leakage Failures of a Bipolar Transistor in 0.5 um BiCMOS Devices - TEM Cross-Sectional Analysis of ESD Induced Damage in Input Protection Circuitry - A Study of Measurement Methods for Detecting Voiding and Delamination of Die Attach Materials in Power Semiconductor Devices - Failure Analysis of the Die-Attach in a Metal-Type Package - Charge Diffusion and Reciprocity Theorems: A Direct Approach to EBIC of Ridge Laser Diodes - Characterization and Elimination of Forward Snapback Defects in GaAs Light Emitting Diodes - Temperature Dependence of Quiescent Currents as a Defect Prognosticator and Evaluation Tool - Contactless Testing of Pulse Propagation in IC's-A Comparison Between OBIC and Captive-Coupling Detection Techniques - Electron-Beam Analysis of the Turn-On Speed of Grounded-Gate NMOS ESD Protection Transistors During Charged Device-Model Stress Pulses - Contactless Function Test of Integrated Circuits on the Wafer - Package Related Failure Mechanisms in Plastic BGA Packages Used for ASIC Devices - Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy - Signature Analysis of Package Delamination Using Scanning Acoustic Microscope - A Case Study of Post De-Tape Cleans on Mold Compound Adhesion - Spatial Evaluation of Resolution in a Scanning Ultrasonic Microscope. Microassembling Technologies Characterization: Differences Between A-Scan and C-Scan Analysis Modes - Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards - A Review of Wet Etch Formulas for Silicon Semiconductor Failure Analysis 301 Carbon Coating for Electron Beam Testing and Focus Ion Beam Reconfiguration - A Technique for Achieving Precision Cross Sections of Released Surface Micromachined Structures - The Study of ESD Destructive Mechanism for PN-Junction - Interconnect Failure Dependence on Crystallographic Structure - Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures - Mechanism Study of Contact Corrosion in Unpatterned Metal Wafer - TPLY for Yield Improvement - A New Robust Backside Flip-Chip Probing Methodology "