Hasil Pencarian  ::  Simpan CSV :: Kembali

"Penelitian ini bertujuan untuk mendapatkan prosedur kerja atau Standard Operating Procedure (SOP) rancangan sistem pemantauan kualitas supplier yang mempertimbangkan level non-conformity. Sistem yang ada di manufaktur elektronik sebagai tempat penelitian belum cukup efektif, penanganan untuk semua non-conformity yang terjadi menggunakan Corrective Action Request (CAR) form. Untuk merancang sistem ini, metode utama yang digunakan dalam penelitian ini adalah Quality Function Deployment (QFD). Penelitian ini menggunakan historical data dari non-conformity yang terjadi selama bulan Juli – Desember 2021. Dari penelitian ini dihasilkan sebuah sistem pemantauan kualitas supplier berupa prosedur kerja atau SOP yang mengklasifikasikan level non-conformity berdasarkan critical level yang merujuk pada dampak non-conformity tersebut pada bisnis perusahaan dan juga dihasilkan corrective action yang sesuai dengan level non-conformity.

---

The purpose of this study is to obtain working procedures or Standard Operating Procedures (SOPs) of supplier quality monitoring system designs that consider the level of non-conformity. The existing approach used in electronics production is ineffective in handling all non-conformities that occur utilizing the Corrective Action Request (CAR) form. The key method employed in this research to design this system is Quality Function Deployment (QFD).

This research used the non-conformities data that happened between July and December 2021. This study yielded a supplier quality monitoring system in the form of work procedures or SOP, which classifies the level of non-conformity based on the critical level, which refers to the impact of the non-conformity on the company's business and also produces corrective actions based on the level of non-conformity."

"Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead free solder : mechanics and reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests."