Ditemukan 1 dokumen yang sesuai dengan query
Huang, YongAn, author
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to...
Singapore: Springer Nature, 2019
e20509271
eBooks Universitas Indonesia Library
