Ditemukan 5 dokumen yang sesuai dengan query
Manko, Howard H., author
New York: McGraw-Hill , 1979
671.56 MAN s
Buku Teks Universitas Indonesia Library
Manko, Howard H., author
New York: Mir Publishers, 1964
671.56 MAN s
Buku Teks Universitas Indonesia Library
The topics addressed in this proceedings volume include active brazing (an area of increasing R&D interest); conventional brazing an soldering alloys; wetting and fundamental properties studies; modeling and mechanical analysis and/or characterization; and process technology. All of the papers in this volume have been editorially reviewed. Both the hardcopy and...
Materials Park, Ohio: ASM International, 2006
e20451907
eBooks Universitas Indonesia Library
Humpston, Giles, author
If you work with soldering processes or soldered components, Principles of Soldering will help you understand and solve practical engineering challenges. Clearly written and well referenced, this book takes you from the fundamental characteristics of solders, fluxes, and joining environments to the impact these have in the selection and successful...
Materials Park, Ohio: ASM International, 2004
e20442559
eBooks Universitas Indonesia Library
Pang, John Hock Lye, author
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards....
New York: Springer, 2012
e20418456
eBooks Universitas Indonesia Library
