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Ditemukan 2 dokumen yang sesuai dengan query
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Liu, Yang
Abstrak :
This SpringerBrief presents a recent advancement in modeling and measurement of the effect of surface wettability on the defrost process. Carefully controlled laboratory measurements of the defrosting of cooled surfaces are used to reveal the effect of surface wetting properties on the extent and speed of frost removal by melting or slumping. The experiments are accompanied by visualization of frost removal at several defrosting conditions. Analysis breaks the defrost process into three stages according to the behavior of the meltwater. Surface wetting factors are included, and become significant when sufficient meltwater accumulates between the saturated frost layer and the surface. The book is aimed at researchers, practicing engineers and graduate students.
Switzerland: Springer Cham, 2019
e20502889
eBooks  Universitas Indonesia Library
cover
Abstrak :
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.
Switzerland: Springer Cham, 2019
e20503329
eBooks  Universitas Indonesia Library