ISTFA 2005: Proceedings of the 31st International Symposium for Testing and Failure Analysis, November 6-10, 2005, McEnery Convention Center, San Jose, California
Sponsored by ASM International (ASM International, 2005)
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In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and overcomes some significant problems encountered with alternative resolution enhancing schemes |
ISTFATM 2005- proceedings of the 31st international symposium for testing and failure analysis, November 6-10, 2005 McEnery Convention Center San Jose, California.pdf :: Unduh
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No. Panggil : | e20442491 |
Subjek : | |
Penerbitan : | Materials Park, Ohio: ASM International, 2005 |
Sumber Pengatalogan: | LibUI eng rda |
Tipe Konten: | text |
Tipe Media: | computer |
Tipe Pembawa: | online resource |
Deskripsi Fisik: | 516 pages : illustration |
Tautan: | http://portal.igpublish.com/iglibrary/search/ASMIB0000001.main.html?14 |
Lembaga Pemilik: | |
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No. Panggil | No. Barkod | Ketersediaan |
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e20442491 | TERSEDIA |
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