ISTFA '98: proceedings of the 24th International Symposium for Testing and Failure Analysis, 15-19 November 1998, Hyatt Regency DFW, Dallas, Texas
Sponsored by ASM International (ASM International, 1998)
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| Contents :- Keynote Presentation - Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup - Session 1: Advanced Techniques - Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow Trench Isolation CMOS Structures: Correlation With Defect Generation and Diode Leakage - Microthermal Imaging Based on the Transmission Change of a Thermochromic Dye Film - High Spatial Resolution OBIRCH and OBIC Effects Realized by Near-Field Optical Probe in the Analysis of High Resistance 200 nm wide TiSi Line - Advanced Failure Analysis of Deep-Submicron CMOS Device Dopant Profiles Using Scanning Kelvin Probe Microscopy - Scanning Capacitance Microscopy use in the Failure Analysis of Vcc Shorts in an Advanced Microprocessor - Session 2: FIB I - Focused Ion Beam Irradiation Induced Damages on CMOS and Bipolar Technologies - AC Hot-Carrier Effects Characterization by Circuit Modification Using Focused Ion Beam - Performing Circuit Modification and Debugging Using Focused-Ion-Beam on Multi-Layered C4 Flip-Chip Devices - Focused Ion Beam Application in Solving RFIC Oscillation Problem - Session 3: Military - The RAC Data Sharing Consortium: Sharing Test, Field and Failure Analysis Data - Failure Analysis of a Qualification Unit Injector for a Satellite Thruster - Preliminary Study of Alternative Material Development of Ballistic Attributes - Metallurgical Examination of a Galled PH 13-8 Mo Stainless Steel Main Rotor Sub-Assembly - Effects of Prior Processing on the Performance of PH 13-8 Mo Stainless Steel - Session 4: FIB II - In-Situ Electrical Monitoring and Contactless Measurement Techniques for Enhanced FIB Modifications - The Challenges of FIB Chip Repair & Debug Assistance in the 0.25 um Copper Interconnect Millennium - A Selected Area Planar TEM (SAPTEM) Sample Preparation Procedure for Failure Analysis of Integrated Circuits - Session 5: ESD - ESD Induced Failures in Cermet Trim Potentiometers - Basic Physics in Color-Coded EOS Metallization Failures (Differentiating Between EOS and ESD) - ESD Induced Failure of an Internal MOSFET in a Mixed Signal IC due to Two Different Power Supplies - Session 6: Techniques I - An Effective and Practical Analysis Technique for Open Defect Isolation at IDD Leakage Failure by Observing Transient Photo Emission - Thermally Assisted Photoemission for CMOS Device Analysis - Non-Contact Probing of Integrated Circuits Using Electrostatic Force Sampling - Session 7: Case History I - A Hermetic Package Internal Water Vapor Paradox: Nonconforming Product That Does Not Fail - Graphical Representation of Permanent Defects in Hard Disk Drives - Evaluation of Pt/PZT/Pt Capacitors Using Sims - Session 8: Techniques II - Evaluation of the Resistance of Individual Si Die to Cracking - Aluminum Interconnect Response to Electrical Overstress - Identification of Charging Effects in Plasma-Enhanced TEOS Deposition with Non-Contact Test Techniques - Session 9: Case History II - Passive Voltage Contrast Technique for Rapid In-Line Characterization and Failure Isolation During Development of Deep-Submicron ASIC CMOS Technology - Failure Analysis Case Study of PALs Used in the Flight Control Circuitry of Paveway III Laser Guided Bombs - ATE Failure Isolation Methodologies for Failure Analysis, Design Debug and Yield Enhancement - Session 10: Testing - Realistic Database for Semiconductor Device Analysis - Auto-Fault-Locating-System for Mounting Boards - Faster Defect Localization with a New Development of IDDQ - Session 11: Case History III - A Study on Discolored Bondpads and Galvanic Corrosion - Investigation of High Via Resistance of a 0.25 um CMOS ASIC Technology - Electromigration in Gold Line of GaAs IC - Session 12: Poster Sessions - Investigations of Leakage Paths in Sub-0.35 um DRAM Products Using Advanced Focused Ion Beam Techniques - Non-Destructive Chemical Decapsulation Techniques for TBGA Package Devices - Techniques to Remove the C4 Die from a Ceramic Package - Simple Flip Chip Analysis Strategies - The Logic Mapper - Making the Most of the Internet for Failure Analysis - High-Yield and High-Throughput TEM Sample Preparation Using Focused Ion Beam Automation - Application of EMS Analysis to Failure in Cell Area of Memory Device - Session 13: Discretes - Reduced Device Life Caused by Flux Entrapment During the Construction Process - Mechanical/Plasma Decapsulation Method and Thermal Finite-Element Analysis Provide Explanation for SMB Zener Failures - Innovative Ap |
 ISTFA '98 proceedings of the 24th international symposium for testing and failure analysis, 15-19 November 1998, Hyatt Regency DFW Dallas, Texas.pdf :: Unduh
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| No. Panggil : | e20442507 |
| Subjek : | |
| Penerbitan : | Materials Park, Ohio: ASM International, 1998 |
| Sumber Pengatalogan: | LibUI eng rda |
| Tipe Konten: | text |
| Tipe Media: | computer |
| Tipe Pembawa: | online resource |
| Deskripsi Fisik: | xx, 490 pages : illustration |
| Tautan: | http://portal.igpublish.com/iglibrary/search/ASMIB0000023.main.html?5 |
| Lembaga Pemilik: | |
| Lokasi: |
| No. Panggil | No. Barkod | Ketersediaan |
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| e20442507 | TERSEDIA |
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