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ISTFA '98: proceedings of the 24th International Symposium for Testing and Failure Analysis, 15-19 November 1998, Hyatt Regency DFW, Dallas, Texas

Sponsored by ASM International (ASM International, 1998)

 Abstrak

Contents :
- Keynote Presentation
- Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That
an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup
- Session 1: Advanced Techniques
- Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow
Trench Isolation CMOS Structures: Correlation With Defect Generation and Diode
Leakage
- Microthermal Imaging Based on the Transmission Change of a Thermochromic
Dye Film
- High Spatial Resolution OBIRCH and OBIC Effects Realized by Near-Field
Optical Probe in the Analysis of High Resistance 200 nm wide TiSi Line
- Advanced Failure Analysis of Deep-Submicron CMOS Device Dopant Profiles
Using Scanning Kelvin Probe Microscopy
- Scanning Capacitance Microscopy use in the Failure Analysis of Vcc Shorts in an
Advanced Microprocessor
- Session 2: FIB I
- Focused Ion Beam Irradiation Induced Damages on CMOS and Bipolar
Technologies
- AC Hot-Carrier Effects Characterization by Circuit Modification Using Focused Ion
Beam
- Performing Circuit Modification and Debugging Using Focused-Ion-Beam on
Multi-Layered C4 Flip-Chip Devices
- Focused Ion Beam Application in Solving RFIC Oscillation Problem
- Session 3: Military
- The RAC Data Sharing Consortium: Sharing Test, Field and Failure Analysis
Data
- Failure Analysis of a Qualification Unit Injector for a Satellite Thruster
- Preliminary Study of Alternative Material Development of Ballistic Attributes
- Metallurgical Examination of a Galled PH 13-8 Mo Stainless Steel Main Rotor
Sub-Assembly
- Effects of Prior Processing on the Performance of PH 13-8 Mo Stainless Steel
- Session 4: FIB II
- In-Situ Electrical Monitoring and Contactless Measurement Techniques for
Enhanced FIB Modifications
- The Challenges of FIB Chip Repair & Debug Assistance in the 0.25 um Copper
Interconnect Millennium
- A Selected Area Planar TEM (SAPTEM) Sample Preparation Procedure for
Failure Analysis of Integrated Circuits
- Session 5: ESD
- ESD Induced Failures in Cermet Trim Potentiometers
- Basic Physics in Color-Coded EOS Metallization Failures (Differentiating
Between EOS and ESD)
- ESD Induced Failure of an Internal MOSFET in a Mixed Signal IC due to Two
Different Power Supplies
- Session 6: Techniques I
- An Effective and Practical Analysis Technique for Open Defect Isolation at IDD
Leakage Failure by Observing Transient Photo Emission
- Thermally Assisted Photoemission for CMOS Device Analysis
- Non-Contact Probing of Integrated Circuits Using Electrostatic Force Sampling
- Session 7: Case History I
- A Hermetic Package Internal Water Vapor Paradox: Nonconforming Product That
Does Not Fail
- Graphical Representation of Permanent Defects in Hard Disk Drives
- Evaluation of Pt/PZT/Pt Capacitors Using Sims
- Session 8: Techniques II
- Evaluation of the Resistance of Individual Si Die to Cracking
- Aluminum Interconnect Response to Electrical Overstress
- Identification of Charging Effects in Plasma-Enhanced TEOS Deposition with
Non-Contact Test Techniques
- Session 9: Case History II
- Passive Voltage Contrast Technique for Rapid In-Line Characterization and
Failure Isolation During Development of Deep-Submicron ASIC CMOS
Technology
- Failure Analysis Case Study of PALs Used in the Flight Control Circuitry of
Paveway III Laser Guided Bombs
- ATE Failure Isolation Methodologies for Failure Analysis, Design Debug and
Yield Enhancement
- Session 10: Testing
- Realistic Database for Semiconductor Device Analysis
- Auto-Fault-Locating-System for Mounting Boards
- Faster Defect Localization with a New Development of IDDQ
- Session 11: Case History III
- A Study on Discolored Bondpads and Galvanic Corrosion
- Investigation of High Via Resistance of a 0.25 um CMOS ASIC Technology
- Electromigration in Gold Line of GaAs IC
- Session 12: Poster Sessions
- Investigations of Leakage Paths in Sub-0.35 um DRAM Products Using Advanced
Focused Ion Beam Techniques
- Non-Destructive Chemical Decapsulation Techniques for TBGA Package
Devices
- Techniques to Remove the C4 Die from a Ceramic Package
- Simple Flip Chip Analysis Strategies
- The Logic Mapper
- Making the Most of the Internet for Failure Analysis
- High-Yield and High-Throughput TEM Sample Preparation Using Focused Ion
Beam Automation
- Application of EMS Analysis to Failure in Cell Area of Memory Device
- Session 13: Discretes
- Reduced Device Life Caused by Flux Entrapment During the Construction
Process
- Mechanical/Plasma Decapsulation Method and Thermal Finite-Element Analysis
Provide Explanation for SMB Zener Failures
- Innovative Ap

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 Metadata

No. Panggil : e20442507
Subjek :
Penerbitan : Materials Park, Ohio: ASM International, 1998
Sumber Pengatalogan: LibUI eng rda
Tipe Konten: text
Tipe Media: computer
Tipe Pembawa: online resource
Deskripsi Fisik: xx, 490 pages : illustration
Tautan: http://portal.igpublish.com/iglibrary/search/ASMIB0000023.main.html?5
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