ISTFA 2008: conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA
ASM International (ASM International, 2008)
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| This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results. |
 ISTFA 2008TM conference proceedings from the 34th international symposium for testing and failure analysis.pdf :: Unduh
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| No. Panggil : | e20442550 |
| Subjek : | |
| Penerbitan : | Materials Park, Ohio: ASM International, 2008 |
| Sumber Pengatalogan: | LibUI eng rda |
| Tipe Konten: | text |
| Tipe Media: | computer |
| Tipe Pembawa: | online resource |
| Deskripsi Fisik: | xx, 528 pages : illustration |
| Tautan: | http://portal.igpublish.com/iglibrary/search/ASMIB0000038.main.html?9 |
| Lembaga Pemilik: | |
| Lokasi: |
| No. Panggil | No. Barkod | Ketersediaan |
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| e20442550 | TERSEDIA |
| Ulasan: |
| Tidak ada ulasan pada koleksi ini: 20442550 |
