Joining of advanced and specialty materials VII: proceedings from materials solutions 2004 on joining of advanced and specialty materials, October 18–20, 2004 columbus, Ohio
(ASM International, 2005)
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| Contents : - Recent Developments in Weldability Testing for Advanced Materials - Reactive Air Brazing for High-Temperature Electrochemical Applications - The Effect of High-Temperature Dual Reducing/Oxidizing Gas Conditions on Silver-Based Filler Metal Compositions - Development of Hyper-Interfacial Bonding Process of Ultra-Fine Grained High Strength Steels - Important Lessons Learnt in the Design of Consumables for Welding High Strength Steels - The Development of a Compressive Residual Stress Around a Structural Steel Weld by Means of Phase Transformations - Micro Electron Beam Welding in an SEM - Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and it’s Corrosion Resistance - The Effect of Surface Tension on Microjoining - Interfacial Reaction Between Sn-8Zn-3Bi and Ni/Au Plating - Room Temperature Lead-Free Soldering of Microelectronic Components using a Local Heat Source - Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder and Au/Ni-Co Plating - Microstructural Characterization of Eutectic Sn-Au Solder as a Lead-free Solution - Effects of Melt-Pool Geometry and Substrate Orientation on Microstructure Development in Laser Surface Melting of Single Crystal Superalloys - Weldability of Ni-Base Single Crystal Superalloys - Microstructure of Laser Deposited Superalloy RENE 80 on GTD-111 - Designing Sealing Glasses for Solid Oxide Fuel Cells - Glass-Ceramics for Sealing Solid Oxide Fuel Cells - Compressive Mica Seals for Solid Oxide Fuel Cells - High Temperature Seals for Solid Oxide Fuel Cells (SOFC) - A New Sealing Concept for Planar Solid Oxide Fuel Cells - Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd: YAG Laser Irradiation - Damage Control of Soldering Iron Tip for Lead-Free Solder - Resistance Microwelding of Fine Nickel Wires - Novel Bonding Process Using Ag Nanoparticles - Influence of Bonding Conditions - - YAG Laser and TIG Arc Hybrid Welding Phenomena - Effect of Joint Design on Mechanical Properties of AL7075 Weldment - Properties of Weld Joints of Bake-Hardening Steel for Automobile - Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University- Industry Design Project Collaboration - Effect of Ni Addition on Interfacial Reaction between Sn-Cu Solder and Cu Base Metal - Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn- Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu land |
 Joining of advanced and specialty materials VII- proceedings from materials solutions 2004 on joining of advanced and specialty materials, October 18?20, 2004 columbus, Ohio.pdf :: Unduh
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| No. Panggil : | e20442560 |
| Subjek : | |
| Penerbitan : | Materials Park, Ohio: ASM International, 2005 |
| Sumber Pengatalogan: | LibUI eng rda |
| Tipe Konten: | text |
| Tipe Media: | computer |
| Tipe Pembawa: | online resource |
| Deskripsi Fisik: | vii, 218 pages : illustration |
| Tautan: | http://portal.igpublish.com/iglibrary/search/ASMIB0000089.main.html?2 |
| Lembaga Pemilik: | |
| Lokasi: |
| No. Panggil | No. Barkod | Ketersediaan |
|---|---|---|
| e20442560 | TERSEDIA |
| Ulasan: |
| Tidak ada ulasan pada koleksi ini: 20442560 |
