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Microelectronic failure analysis: desk reference, 2001 supplement

The electronic Device Failure Analysis Society (ASM International, 2001)

 Abstrak

Contents :
- Microelectronics failure analysis desk reference, 2001 supplement
- Preface
- Microelectronic Failure Analysis Desk Reference 2001 Supplement
- FIB Backside Isolation Techniques
- The SEM Lab, From Laboratory Logistics to Final Sample Preparation
Techniques for SEM Analysis of Semiconductors
- Cross Sectioning with a Pivoting Sample Block
- Focused Ion Beam Cross Sectioning as a Compliment or an Alternative to
Conventional Mechanical Sectioning Techniques
- Alternatives to Cross-Sectional Simple Preparation for Package and Board-Level
Failure Analysis
- Automation To Boost Productivity And Increase Repeatability: (A Sampling of
Available Tools and Vendors)
- Multi-Functional, Semi-Automatic Sample Preparation for Failure Analysis
- SMPTĀ©-Sub-Micron Polishing Technology For Automated Sample Preparation
- Automated Techniques For SEM And TEM Sample Preparation
- Sample Preparation Techniques for Site-Specific Cross-Sectional Analysis of
High-Aspect-Ratio FIB Repair Sites
- Deprocessing, Cross-Sectioning and FIB Circuit Modification of Parts Having
Copper Metallization
- Scanning Capacitance Microscopy of Junction and Non-Junction Samples
- Electrical Probing of Deep Sub-Micron Integrated Circuits Using Scanning Probe
Techniques
- Application of Tunneling Atomic Force Microscopy (TUNA) to Failure Analysis
- GoFATA: Glossary of Failure Analysis Tool Acronyms
- ISTFA Subject Index

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