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MEMS packaging

edited by Tai-Ran Hsu (Institute of South East Asia Studies, 2009)

 Abstrak

This book discusses the prevalent practices and enabling techniques in the assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics covered include the bonding and sealing of microcomponents, the process flow of MEMS and microsystem packaging, automated microassembly, and testing and design for testing.

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 Metadata

No. Panggil : e20452752
Entri tambahan-Nama orang :
Subjek :
Penerbitan : London: Institute of South East Asia Studies, 2009
Sumber Pengatalogan: LibUI eng rda
Tipe Konten: text
Tipe Media: computer
Tipe Pembawa: online resource
Deskripsi Fisik: xxix, 275 pages : illustration
Tautan: http://portal.igpublish.com/iglibrary/search/IETB0000106.main.html?11
Lembaga Pemilik:
Lokasi:
  • Ketersediaan
  • Ulasan
No. Panggil No. Barkod Ketersediaan
e20452752 02-17-343724120 TERSEDIA
Ulasan:
Tidak ada ulasan pada koleksi ini: 20452752