Full Description
| Responsibility Statement | YongAn Huang, Zhouping Yin, Xiaodong Wan |
| Language Code | eng |
| Edition | |
| Collection Source | Springer |
| Cataloguing Source | LibUI eng rda |
| Content Type | text (rdacontent) |
| Media Type | computer (rdamedia) |
| Carrier Type | online resource (rdacarrier) |
| Physical Description | xvii, 287 pages : illustration |
| Link | https://doi.org/10.1007/978-981-13-3627-0 |
- Availability
- Digital Files: 1
- Review
- Cover
- Abstract
| Call Number | Barcode Number | Availability |
|---|---|---|
| e20509271 | 02-20-291615825 | TERSEDIA |
| No review available for this collection: 20509271 |
Abstract
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.