Modeling and application of flexible electronics packaging
YongAn Huang, Zhouping Yin, Xiaodong Wan
(Springer Nature, 2019)
|
| This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics. |
 Modeling and Application of Flexible Electronics Packaging.pdf :: Unduh
|
| No. Panggil : | e20509271 |
| Entri utama-Nama orang : | |
| Entri tambahan-Nama orang : | |
| Subjek : | |
| Penerbitan : | Singapore: Springer Nature, 2019 |
| Sumber Pengatalogan: | LibUI eng rda |
| Tipe Konten: | text |
| Tipe Media: | computer |
| Tipe Pembawa: | online resource |
| Deskripsi Fisik: | xvii, 287 pages : illustration |
| Tautan: | https://doi.org/10.1007/978-981-13-3627-0 |
| Lembaga Pemilik: | |
| Lokasi: |
| No. Panggil | No. Barkod | Ketersediaan |
|---|---|---|
| e20509271 | 02-20-291615825 | TERSEDIA |
| Ulasan: |
| Tidak ada ulasan pada koleksi ini: 20509271 |
