:: Artikel Jurnal :: Kembali

Artikel Jurnal :: Kembali

Seedless-electroplating process development for micro-features realization

Tito Sitanggang, Jos Istiyanto, Sugeng Supriadi (Faculty of Engineering, Universitas Indonesia, 2015)

 Abstrak

This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a range of ±1.5µm. Moreover, a resolution of ±10µm and roughness (Ra) of ±0.31µm was achieved during the metal deposition process.

 Metadata

No. Panggil : UI-IJTECH 6:6 (2015)
Entri utama-Nama orang :
Subjek :
Penerbitan : Depok: Faculty of Engineering, Universitas Indonesia, 2015
Sumber Pengatalogan : LibUI eng rda
ISSN : 20869614
Majalah/Jurnal : International Journal of Technology
Volume : Vol. 6, No. 6, December 2015: Hal. 1050-1056
Tipe Konten : text
Tipe Media : unmediated
Tipe Carrier : volume
Akses Elektronik : https://doi.org/10.14716/ijtech.v6i6.1724
Institusi Pemilik : Universitas Indonesia
Lokasi : Perpustakaan UI, Lantai 4 R. Koleksi Jurnal
  • Ketersediaan
  • Ulasan
No. Panggil No. Barkod Ketersediaan
UI-IJTECH 6:6 (2015) 08-23-40938973 TERSEDIA
Ulasan:
Tidak ada ulasan pada koleksi ini: 9999920522019