Seedless-electroplating process development for micro-features realization
Tito Sitanggang, Jos Istiyanto, Sugeng Supriadi
(Faculty of Engineering, Universitas Indonesia, 2015)
|
| This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a range of ±1.5µm. Moreover, a resolution of ±10µm and roughness (Ra) of ±0.31µm was achieved during the metal deposition process. |
| No. Panggil : | UI-IJTECH 6:6 (2015) |
| Entri utama-Nama orang : | |
| Subjek : | |
| Penerbitan : | Depok: Faculty of Engineering, Universitas Indonesia, 2015 |
| Sumber Pengatalogan : | LibUI eng rda |
| ISSN : | 20869614 |
| Majalah/Jurnal : | International Journal of Technology |
| Volume : | Vol. 6, No. 6, December 2015: Hal. 1050-1056 |
| Tipe Konten : | text |
| Tipe Media : | unmediated |
| Tipe Carrier : | volume |
| Akses Elektronik : | https://doi.org/10.14716/ijtech.v6i6.1724 |
| Institusi Pemilik : | Universitas Indonesia |
| Lokasi : | Perpustakaan UI, Lantai 4 R. Koleksi Jurnal |
| No. Panggil | No. Barkod | Ketersediaan |
|---|---|---|
| UI-IJTECH 6:6 (2015) | 08-23-40938973 | TERSEDIA |
| Ulasan: |
| Tidak ada ulasan pada koleksi ini: 9999920522019 |
