Ditemukan 12 dokumen yang sesuai dengan query
New York: American Institute of Chemical Engineers, [1987]
621.381 PRO p
Buku Teks Universitas Indonesia Library
Buku yang berjudul "Electronic materials handbook : volume 1 packaging" ini merupakan sebuah buku panduan mengenai material elektronik...
[Place of publication not identified]: ASM International, 1989
R 621.381 ELE I
Buku Referensi Universitas Indonesia Library
Colclaser, Roy A., author
New York:: McGraw-Hill, 1985
621.381 COL m
Buku Teks Universitas Indonesia Library
London: Chapman & Hall, 2018
537 JMS
Majalah, Jurnal, Buletin Universitas Indonesia Library
Contents :
- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging
Techniques in CMOS Failure Analysis
- Infrared Light Emission From Semiconductor Devices
- The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI
Circuits
-...
Materials Park, Ohio: ASM International, 1996
e20442490
eBooks Universitas Indonesia Library
In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution...
Materials Park, Ohio: ASM International, 2005
e20442491
eBooks Universitas Indonesia Library
New York: McGraw-Hill, 1994
621.381 ELE
Buku Teks Universitas Indonesia Library
Contents :
- Testing-Based Failure Analysis: A Critical Component of the SIA Roadmap Vision
- Experimental Figures for the Defect Coverage of IDDQVectors
- A CAD-Based Approach to Failure Diagnosis of CMOSLSI with Single Fault
Using Abnormal IDDQ
- Test and Failure Analysis Implications of a Novel...
Materials Park, Ohio: ASM International, 1997
e20442506
eBooks Universitas Indonesia Library
Contents :
- Keynote Presentation
- Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That
an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup
- Session 1: Advanced Techniques
- Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in...
Materials Park, Ohio: ASM International, 1998
e20442507
eBooks Universitas Indonesia Library
Contents :
- Terahertz Imaging: A New Technique for Inspection of Dielectric Materials
- Detecting Power Shorts from Front and Backside of IC Packages Using Scanning
SQUID Microscopy
- Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing
- Optical Probing of VLSI IC’s from the...
Materials Park, Ohio: ASM International, 1999
e20442508
eBooks Universitas Indonesia Library
