Ditemukan 1 dokumen yang sesuai dengan query
Lau, John H., author
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs)....
Springer Nature, 2019
e20508943
eBooks Universitas Indonesia Library
