Lead-free solder interconnect reliability
edited by Dongkai Shangguan
ASM International, 2005
 eBooks
Dwi Kencono Putro, author
Desain dan simulasi sensor mikrobolometer sebagai aplikasi untuk inspeksi instalasi listrik = Design and simulation of sensor microbolometer for electrical installation inspection
Fakultas Teknik Universitas Indonesia, 2013
 UI - Skripsi (Membership)
Advances in electronic circuit packaging : proceedings..., vol. 1 / Edited by Gerald A. Walker
Plenum Press, 1962
 Buku Teks
Yong, Liu, author
Power electronic packaging: design, assembly process, reliability and modeling
[, Springer], 2012
 eBooks
Lee, Dong Sun, author
Food Packaging science and technology
CRC Press, Taylor & Francis Group, 2008
 Buku Teks
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