Studi elektrokimia pada printed circuit board menggunakan larutan asam sulfat dengan variasi konsentrasi asam sulfat dan waktu celup = Electrochemical study of printed circuit board leaching process using sulfuric acid solution with variation of sulfuric acid concentration and immersion time

Studi elektrokimia printed circuit board (pcb) pada larutan asam klorida (hcl) dengan variasi konsentrasi asam klorida (hcl) dan waktu celup = Electrochemical study of printed circuit board (pcb) in chloride solution with variation of chloride solution concentration (hcl) and immersion time

Comparative study of electrochemical leaching between multilayer used PCB and double layer plain PCB using sulfuric acid (H2SO4) with concentration variables = Studi perbandingan elektrokimia pada proses pelindian Printed Circuit Board (PCB) bekas multilayer dan Printed Circuit Board (PCB) double layer menggunakan larutan asam sulfat (H2SO4) dengan variable konsentrasi

Studi elektrokimia tembaga dari printed circuit board (PCB) dengan larutan asam klorida (HCl) dan aditif hidrogen peroksida (H2O2) = Electrochemical study of copper leaching in printed circuit board with hydrochloric acid (HCl) and additive hydrogen peroxide (H2O2)

Pengaruh konsentrasi oksidator H2O2 dan MnO2 terhadap recovery logam emas dan tembaga pada pelindian printed circuit board dalam media asam klorida = The effect of H2O2 and MnO2 oxidizing agent concentration on the recovery of gold and cooper metals in printed circuit board in chloric acid leaching media