Studi elektrokimia tembaga dari printed circuit board (PCB) dengan larutan asam klorida (HCl) dan aditif hidrogen peroksida (H2O2) = Electrochemical study of copper leaching in printed circuit board with hydrochloric acid (HCl) and additive hydrogen peroxide (H2O2)

Studi elektrokimia pelindian tembaga pada printed circiut board menggunakan larutan asam nitrat (HNO3) dengan variasi konsentrasi asam nitrat dan waktu celup = Electrochemical study of copper leaching in printed circuit board with nitric acid solution (HNO3) using variation of nitric acid concentration and immersion time

Pengaruh konsentrasi karbon aktif terhadap peningkatan kadar logam emas pada pelindian limbah printed circuit board dalam media asam klorida = Effect of concentration of activated carbon to gold metal recovery of printed circuit board leaching in hydrochloric acid

Perolehan kembali logam Cu dari limbah printed circuit boards (PCBS) menggunakan leaching agent HCL dan asam sitrat serta ekstraksi cair-cair menggunakan ekstraktan LIX84-ICNS= Recovery of Cu metals from printed circuit boards (PCBs) waste using leaching agent HCL and citric acid and liquid liquid extraction using LIX84-ICNS

Pengaruh jenis dan konsentrasi larutan leaching terhadap recovery logam emas dan tembaga dari hasil daur ulang printed circuit board = Effect of type and concentration of leaching solution towards the recovery of gold and copper metals from recycled printed circuit board