Studi Evolusi Partikel Leached Printed Circuit Board (PCB) Pada Proses Dry Milling = Study of Particle Evolution in Leached Printed Circuit Board (PCB) during Dry Milling

Studi Analisis Evolusi Ukuran Partikel Printed Circuit Board (PCB) Non-treatment Pada Proses Dry Milling = Study of Particle Evolution Analysis of Printed Circuit Board (PCB) Non-treatment in Dry Milling Process

Analisis Evolusi Ukuran Partikel Printed Circuit Board (PCB) Non-Treatment Pada Proses Wet Milling Menggunakan Shaker Mill dan Process Control Agent Etanol = Analysis of Particle Size Evolution of Non-Treatment Printed Circuit Board (PCB) in a Wet Milling Process Using a Shaker Mill and Process Control Agent Ethanol

Comparative study of electrochemical leaching between multilayer used PCB and double layer plain PCB using sulfuric acid (H2SO4) with concentration variables = Studi perbandingan elektrokimia pada proses pelindian Printed Circuit Board (PCB) bekas multilayer dan Printed Circuit Board (PCB) double layer menggunakan larutan asam sulfat (H2SO4) dengan variable konsentrasi

Pengaruh Penambahan Partikel Non-logam Hasil Daur Ulang Printed Circuit Board dan Surfaktan Sodium Dodecylbenzene Sulfonate sebagai Media Pendingin Micro dispersed fluid pada Proses Quenching Baja AISI 4140 = The Influence of Adding Non-metal Particle from Recycled Printed Circuit Boards and Sodium Dodecylbenzene Sulfonate Surfactant as a Nanofluid Cooling Medium on the Quenching Process of AISI 4140 Steel