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Hasil Pencarian

Ditemukan 17 dokumen yang sesuai dengan query
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Contents : - IPFA 2002 Best Paper Award Winner - SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of Electronic Devices - From Microns to Molecules–Can FA Remain Viable Through the Next Decade? - Soft Defect Localization (SDL) on ICs - Fault Localization and Functional...
Materials Park, Ohio: ASM International, 2002
e20442621
eBooks  Universitas Indonesia Library
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Contents : - Session 1: Advanced Techniques - Scanning Magnetoresistive Microscopy for Die-Level Sub-Micron Current Density Mapping - High Resolution Current Imaging by Direct Magnetic Field Sensing - Fault Isolation of High Resistance Defects using Comparative Magnetic Field Imaging - High Resolution Backside...
Materials Park, Ohio: ASM International, 2003
e20442631
eBooks  Universitas Indonesia Library
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Contents : - Microscopy at the Nanoscale - Polarization Difference Probing: A New Phase Detection Scheme for Laser Voltage Probing - Spray Cooling for Time Resolved Emission Measurements of ICs - A Novel Technique for Detecting High Resistance Fault Using Electroplating - Magnetic Current Imaging...
Materials Park, Ohio: ASM International, 2004
e20442635
eBooks  Universitas Indonesia Library
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand and eliminate electronic device and system failures...
Materials Park, Ohio: ASM International, 2006
e20451852
eBooks  Universitas Indonesia Library
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Shina, Sammy G.,
New York : McGraw-Hill, 2002
621.381 SHI s
Buku Teks  Universitas Indonesia Library
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Contents : - Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors - Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation - Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis...
Materials Park, Ohio: AsM International, 2000
e20442548
eBooks  Universitas Indonesia Library
cover
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and...
Materials Park, Ohio: ASM International, 2008
e20442550
eBooks  Universitas Indonesia Library
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