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"Contents - IPFA 2000 Best Paper Award Winner - Application of Focused Ion Beam System as a Defect Localization and Root Cause Analysis Tool - Session 1: Advanced Techniques 1 - X-Ray Tomography of Integrated Circuit Interconnects: Past and Future - X-ray Nanotomog Raphy (XRMT) Tool for Non-Destructive High-Resolution Imaging of ICs - Single Point PICA Probing with an Avalanche Photo-Diode - Session 2: Advanced Techniques 2 - Comparison of Laser and Emission Based Optical Probe Techniques - Resistive Interconnection Localization - Optical Waveform Probing–Strategies for Non-Flipchip Devices and Other Applications - Advanced LIVA/TIVA Techniques - Session 3: Packaging - Super-conducting Quantum Interference Device Technique: 3-D Localization of a Short Within a Flip Chip Assembly - Integration of SQUID Microscopy into FA Flow - Evaluation of alternative Preparation Methods for Failure Analysis at modern Chip-and Package Technologies - TDR Analysis of Advanced Microprocessors - Signal Trace and Power Plane Shorts Fault Isolation Using TDR - Session 4: Poster Session - Backside Etch: A New FA Technique for Gate Oxide Pinhole and Si Defect Identification for Power IC Devices - Fabrication Of Inexpensive Decapsulation Fixtures for Small or Unique Plastic Packages - Failure Analysis of Plasma-Induced Submicron CMOS IC Yield Loss by Backside Photoemission Microscopy - Failure Types & Analysis In Cu Process Development of Design-Rule 0.18 μm CPU - TEM Examination of a Specified Site Identified by X-SEM in Microelectronics Failure Analysis - Design Debug and Design Fix Verification in a Failure Analysis Lab for a RF/IF Circuit for Cellular Applications With High Battery Save and Electrostatic Discharge Leakage: A Case Study - Self Aligned Contact Wordline-Bitline Shorts in Memory ICs–a Comparative Study of a Failure Mode, Its Root Causes, And Simple, But Highly Effective Analysis Techniques - A Spatial Filtering Localisation Tool for Failure Analysis of Periodic Circuits - New Manifestation of Electrical Overstress in Advanced Device Technologies - Session 5: Backside 1 - Implementing Thermal Laser Stimulation in a Failure Analysis Laboratory - Calibration Technique for MCT FPA used for Backside Emission Microsopy - Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors - New Signal Detection Methods for Thermal Beam Induced Phenomenon - CNC Milling and Polishing Techniques for Backside Sample Preparation - Session 6: SPM - Characterization of MOS Devices by Scanning Thermal Microscopy (SThM) - Contactless Failure Analysis of Integrated Circuits Via Current Contrast Imaging with Magnetic Force Microscopy - Multiple Probe Deep Sub-Micron Electrical Measurements Using Leading Edge Micro-Machined Scanning Probes - Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects - Session 7: Backside 2 - Emission Microscopy and Thermal Laser Stimulation for Backside Failure Localization - CMOS Front-End Investigation over Large Areas by Deprocessing from the Back Side - New Techniques for the Identification of Defects in Multi-Layer Flip-Chip Packages - Session 8: Case Histories 1 - Board Level Failure Analysis of Chip Scale Packages - IC Failure by Electrical Overstress (EOS) - The Search for the Elusive EOS Monster - Session 9: FIB - Effect of Ga Staining due to FIB Editing on IR Imaging of Flip Chips - Water Vapor Enhancement for Elemental Analysis Using Focused Ion Beam Secondary Ion Mass Spectrometry (FIB-SIMS) - Various Focused Ion Beam Microsurgery Techniques in Dealing with Copper Metalization in ICs - Reliability of Bipolar and MOS Circuits After FIB Modification - Mass Production Cross-Section Tem Samples by Focus Ion Beam Masking and Reactive Ion Etching - Session 10: Case Histories 2 - A Successful Failure Analysis Using Front and Backside Fault Localization Techniques on a Deep Sub-Micron CMOS Device - Use of STEM in Nanometer Level Defect Analysis of SRAM Devices - A New Deprocessing Technique By Selective Wet-Etch Of Passivation And Inter Metal Dielectric Layers For Submicron Devices - SRAM Failure Analysis Flow - Physical Failure Analysis on Vertical Dielectric Films - Session 11: MEMS - Design for Reliability of MEMS/MOEMS for Lightwave Telecommunications - Mechanical Characterization of Materials Used in MEMS - Optical Imaging of High-Frequency Resonances and Semi-Static Deformations in Micro-Elec"

"Contents :- Session 1: Advanced Techniques - Scanning Magnetoresistive Microscopy for Die-Level Sub-Micron Current Density Mapping - High Resolution Current Imaging by Direct Magnetic Field Sensing - Fault Isolation of High Resistance Defects using Comparative Magnetic Field Imaging - High Resolution Backside Thermography using a Numerical Aperture Increasing Lens - Session 2: Optical Techniques - Study of Critical Factors Determining Latchup Sensitivity of ICs using Emission Microscopy - New Applications of Thermal Laser Signal Injection Microscopy (T-LSIM) - PC Card Based Optical Probing of Advanced Graphics Processor using Time Resolved Emission - Time-Resolved Optical Measurements from 0.13μm CMOS Technology Microprocessor using a Superconducting Single-Photon Detector - IC Diagnostic with Time Resolved Photon Emission and CAD Auto-channeling - Session 3: Package Level Analysis 1 - 3D X-ray Computed Tomography (CT) for Electronic Packages - High-Angle Electron Microscopy Technique for Analysis of Thin Film Contamination on IC Package Exteriors - Solder Bump Defects in Ceramic Flip Chip Packages and Their Acoustic Signatures. - Copper Bond over Active Circuit (BOAC) and Copper over Anything (COA) Failure Analysis - Investigation of Bond-pad Related Inter-metal Dielectric Crack - Session 4: Sample Preparation 1 - Enhanced SEM Doping Contrast - Interconnect and Gate Level Delayering Techniques for Cu/Low k Technology Failure Analysis - Backside Deprocessing of CMOS SOI Devices for Physical Defect and Failure Analysis - A Novel Approach to Front-side Deprocessing for Thinned Die after Backside Failure Isolation - Session 5: System Level Analysis - Dynamic Infrared System Level Fault Isolation - X-ray Laminography Benchmarking and Failure Analysis of Solder Joint Interfaces - XRF Correlation of Board Reseats due to Intermittent Failures from the use of Thin Gold Plating finish on the Contact Fingers - Session 6: Metrology and Materials Analysis 1 - Deal Time SEM Imaging of FIB Milling Processes for Extended Accuracy on TEM Samples for EFTEM Analysis - A Method for Exact Determination of Dram Deep Trench Surface Area - A Review of TEM Observations of Failures of the Memory Cell in a Deep Trench Capacitor DRAM - The Effect of Tem Specimen Preparation Method on Ultra-thin Gate Dielectric Analysis - Forward Scattered Scanning Electron Microscopy for Semiconductor Metrology and Failure Analysis - Session 7: Failure Analysis Process - Contributions of a Formal Analysis Metaprocess to Breakthrough Failure Analysis Results - SRAM Failure Analysis Strategy - VLSI Design for Functional Failure Analysis in the < 90 nm and Flip-chip era - Identification of an IDDQ Failure Mechanism Using a Variety of Front and Backside Analytical Techniques - Novel Application of Transmission Electron Microscopy and Scanning Capacitance Microscopy for Defect Root Cause Identification and Yield Enhancement - Session 8: Metrology and Materials Analysis 2 - Contact Failure due to Particulate Defect in a 0.13 μm CMOS Process - Microhardness Testing on Via Fill Material for Via In Pad Technology - Application of ToF-SIMS to Airborne Organic Contamination Analysis - Session 9: Test 1 - Yield-Modeling and Test Oriented Taxonomy of IC Structure Deformations - Analysis of IC Manufacturing Process Deformations: An Automated Approach Using SRAM Bit Fail Maps - Electrical Failure Analysis and Characterization of Leakage Paths Leading to Single Cell Failures in 128Mbit SDRAMs - Session 10: Poster - A Study on Fluorine-Induced Corrosion on Microchip Aluminum Bondpads - Advanced Process Defect Detection by Using Dynamic Bias Condition and MCT Camera - Via Chain Failure Analysis Using a Combination of E-Beam and Optical Beam Techniques - ESD Failure Signature Differences in the Devices Core Logic and Protection Structures -- A Case Study - ESD: Correlation between Electrical Signature and Failure Modes - Semi-Automated Cross-Section Process for Complti-Face Perimeter Samples - FIB Micro-pillar sampling of Si devices and its 3D observation - Recent Developments in Automated Sample Preparation for FESEM - Wet Delineation of SEM Samples having Cu Interconnects - An Evolution in Plastic Decapsulation Process Improvement - Near IR Continuous Wavelength Spectroscopy of Photon Emissions from Semiconductor Devices - Defect Isolation and Characterization in Contacts by Using Primary Voltage Adjustment"

"This book constitutes the refereed proceedings of the 32nd Annual International Cryptology Conference, CRYPTO 2012, held in Santa Barbara, CA, USA, in August 2012. The 48 revised full papers presented were carefully reviewed and selected from 225 submissions. The volume also contains the abstracts of two invited talks. The papers are organized in topical sections on symmetric cryptosystems, secure computation, attribute-based and functional encryption, proofs systems, protocols, hash functions, composable security, privacy, leakage and side-channels, signatures, implementation analysis, black-box separation, cryptanalysis, quantum cryptography, and key encapsulation and one-way functions."

"Contents :- Terahertz Imaging: A New Technique for Inspection of Dielectric Materials - Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy - Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing - Optical Probing of VLSI IC’s from the Silicon Backside - Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache - Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits - Comparative TDR Analysis as a Packaging FA Tool - Light Emission Spectral Analysis: The Connection Between the Electric Field and the Spectrum - Temperature Profile Measurement and Failure Characterization of ESD Protection Devices Using Spectroscopic Photon Emission Microscopy and Raman Spectroscopy - Infrared Emission Spectroscopy as a Reliability Tool - Quantitative E-beam Probe for Valid High-Speed Measurements - Short High Voltage Stress for Design-to-Process Characterization - Automatic TEM Sample Preparation - Failure Analysis of Sub-Micron Semiconductor Integrated Circuit Using Backside Photon Emission Microscopy - Sample Preparation for Backside Failure Analysis Using Infrared Photoemission Microscopy - In-situ Use of an Optical Microscope for FIB Microsurgery of Planarized Devices - Investigation on the Corrosion of Cu Metallization in the Focused Ion Beam System Due to a low I2 Background - Tin Corrosion Induced by Corrosive De-Ionized (DI) Water - Latch-Up Induced Slit Voiding in Aluminum Metal Lines - Failure Analysis of Discolored Bondpads in Wafer Fabrication - Optimizing Contact Resistance at a Resistor/Conductor Interface via Thin Film Microanalysis and Process Design of Experiments - Failure Analysis of Plastic Packaged GaAs and AlGaAs/GaAs LEDs - A Technique for Measuring Device Temperature with High Accuracy in Accelerated Operational Life Tests - Temperature Measurement on Micromachined IR Bolometers Using an Infrared Microscope - Automated Translation of Final Test Programs to Inexpensive FA Testers - FMECA Modeling-A New Approach - Selective Au-Etching on Aged GaAs-Based Devices - Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination - Evacuated FM08 Fuses Carry a Sustained Arc in a Bus over 75 VDC - Advanced Statistical Tools for Improving Yield and Reliability - An Application of Passive Voltage Contrast (PVC) to Failure Analysis of CMOS LSIs Using Secondary Electron Collection - Integrated Circuit Device Repair Using FIB system: Tips, Tricks, And Strategies - Modeling and Optimizing XeF2-Enhanced FIB Milling of Silicon - Reliability Test Results for Pt FIB Interconnect Structures - Focused Ion Beam Induced Effects on MOS Transistor Parameters - Relay Failures Specific to Space Applications - Failure Analysis of Autoclave-Stressed SRAMs with Aluminum Fuses - Electrostatic-Discharge (ESD) Failures in Thin-Film Resistors - Characterization of Gold Embrittlement in Solder Joints - In-situ Dual Beam (FIBSEM) Techniques for Probe Pad Deposition and Dielectric Integrity Inspection in 0.2 μm Technology DRAM - Die Backside FIB Preparation for Identification and Characterization of Metal Voids - FIB Micromachining and Nano-Structure Fabrication - Characterization and Fault Identification of Copper BEOL Sub 0.25 um Six Level Metal Microprocessor Designs - Analysis Of Ohmic Contact Metal Deposition Using FIB/SEM For A GaAs MESFET Clock Buffer IC Device - Identification of Subtle Isb Failure Mechanisms - Investigation of High Frequency Failures on a 0.35 um CMOS IC - BGA and Advanced Package Wire to Wire Bonding for Backside Emission Microscopy - Current-Signature-Based Analysis of Complex Test Fails - New Techniques for Logic Fault Diagnosis with a Case Study on the 440 BX Chipset - Electromigration and Electrochemical Reaction Mixed Failure Mechanism in Gold Interconnection System - Identification of Yield-Limiting Defects in a 0.5 Micron, Shallow Trench Isolation Technology - Visualization of Local Gate Depletion in PMOSFETs Using Unique Backside Etching and Selective Etching Technique - Residual Photoresist Identified as Cause for Frequency-Dependent Signal-to- Noise Failure After Autoclave Stress Testing - From IDDQ Fault Detection to Defect Localization in Logic CMOS Integrated Circuits: Key Issues - Recent Advances in Broad Ion Beam Techniques/Instrumentation for SEM Specimen Preparation of Semiconductors - A New Focused-Ion-Beam Microsampling Technique for TEM Observation of Site-specific Area’s - A Combined Infrared/Visible Photoemission Microscope - Correlation of Electronic and Thermal Properties of - Index"