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"This book describes several techniques to address variation-related design challenges for analog blocks in mixed-signal systems-on-chip. The methods presented are results from recent research works involving receiver front-end circuits, baseband filter linearization, and data conversion. These circuit-level techniques are described, with their relationships to emerging system-level calibration approaches, to tune the performances of analog circuits with digital assistance or control. Coverage also includes a strategy to utilize on-chip temperature sensors to measure the signal power and linearity characteristics of analog/RF circuits, as demonstrated by test chip measurements. Describes a variety of variation-tolerant analog circuit design examples, including from RF front-ends, high-performance ADCs and baseband filters. Includes built-in testing techniques, linked to current industrial trends. Balances digitally-assisted performance tuning with analog performance tuning and mismatch reduction approaches. Describes theoretical concepts as well as experimental results for test chips designed with variation-aware techniques."

"This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems."

"As Moore’s law continues to unfold, two important trends have recently emerged. First, the growth of chip capacity is translated into a corresponding increase of number of cores. Second, the parallelization of the computation and 3D integration technologies lead to distributed memory architectures. This book describes recent research that addresses urgent challenges in many-core architectures and application mapping. It addresses the architectural design of many core chips, memory and data management, power management, design and programming methodologies. It also describes how new techniques have been applied in various industrial case studies."

"ABSTRAKTujuan dari tesis ini adalah studi coupled untuk akselarator pada SoC berbasis arsistektur LEON3. Coupling ini menggunakan FIFO FSL (Fast simplex Link) bus dan direalisasikan pada FPGA virtex-6 (board Xilinx ML605). Desain dasar menggunakan APB bus, karena kemudahan dalam segi protokol dan rendah konsumsi energinya. Sedangkan untuk FSL Converter menggunakan Xilinx ISE Library. IP ini ditambahkan dengan menggunakan prinsip plug&pluy extending dari IP GRLIB. Desain coupled ini menggunakan prinsip FSM (finite state machine), simulasi menggunakan ModelSim 6, dan logika sintesis menggunaan ISE. Test real-time menggunakan monitor GRMON. Hasil tes menunjukan penggunaan APB tidak bisa digunakan untuk coupled tightly pada LEON3 karena menggunakan AMBA V.2 berbeda dengan versi 3 yang tidak terbatas, jika dibutuhkan untuk dirubah (tanpa PReady, twait) maka harus diganti dengan menggunakan AHB Bus.

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AbstractThe objectives of the thesis are the studies the coupling of a hardware accelerator in a SoC based on leon3. Coupling created using FSL (Fast Simplex Link) bus with AMBA bus leon3 programmed in FPGA Virtex-6 (Xilinx ML605 board prototype). The initial design use APB bus, because of the simplicity of the APB protocol and low power. FSL converter use Xilinx ISE library. Addition of this IP uses plug&play Extending IP GRLIB. This design coupled includes design based on FSM (finite state machine), simulation using ModelSim and logic synthesis using ISE. The test is based on real-time monitor GRMon. Test results show for the APB could not be tightly coupled because of the SoC based on LEON3 using AMBA bus v2, which unlike the version 3 does not freiner if need an exchange (no pready, Twait): it must be changed using the AHB bus."

"In the electronics industry today consumer demand for devices with hyper-connectivity and mobility has resulted in the development of a complete system on a chip (SoC). Using the old ?rule of thumb? design methods of the past is no longer feasible for these new complex electronic systems. To develop highly successful systems that meet the requirements and quality expectations of customers, engineers now need to use a rigorous, model-based approach in their designs.This book provides the definitive guide to the techniques, methods and technologies for electronic systems engineers, embedded systems engineers, and hardware and software engineers to carry out model- based electronic system design, as well as for students of IC systems design. Based on the authors? considerable industrial experience, the book shows how to implement the methods in the context of integrated circuit design flows."

"Pada penelitian ini dibuat paduan Pd73B27, Pt58B42 dan NiB menggunakan proses metalurgi serbuk. Adapun tujuan dari penelitian ini adalah untuk mengetahui dan memahami struktur dan sifat panas paduan tersebut. Dari hasil analisa difraksi sinar-x menunjukkan bahwa pembuatan ketiga paduan tersebut membentuk multifasa. Fasa Pd73B27 dan Pt58B42 belum diketahui strukturnya mengingat keterbatasan referensi. Fasa Pd membentuk struktur kubik fasa Pt mempunyai struktur kubik FCC, sedangkan fasa NiB membentuk struktur ortorombik . Fasa Boron dalam ketiga paduan membentuk struktur rombohedral . Hasil Spektrometer massa untuk paduan Pd73B27 menunjukkan ion [Pd**] dengan nomor massa 52 dan ion [Pd**] mempunyai dua nomor massa yaitu 110 dan 1051 demikian pula untuk boron yaitu 10 dan 11. Untuk paduan Pt58B42 terbentuk ion [Pt**] dengan nomor massa 97,5 dan [Pt**] 195. Sedangkan ion [B*] mempunyai nomor massa 10 dan 11. Paduan Pt58B42 menunjukkan tiga puncak endotermis pada analisis DTA (Differential Thermal Analysis ). Enthalpi I 6H untuk ketiga puncak adalah -16107 j/g pada suhu puncak 127,99'C, -4,46 j/g pada 182,96'C dan -11107 j/g pada 911,18'C. Diperkirakan bahwa puncak ketiga adalah fasa Pt58B42. Untuk paduan Pd73B27 dan NiB belum menunjukkan hasil yang baik. Bahan mempunyai kenampakan yang rapuh secara makroskopis. Dari hasil pengamatan dengan SEM terlihat adanya butiran pipih khususnya pada paduan Pt58B42. Paduan Pt58B42 dan NiB mempunyai kekerasan yang lebih besar dari paduan Pt58B42.

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In this research, Pd73B27, Pt58B42 and NiB alloys were made using a powder metallurgy process. The aim of this research is to find out and understand the structure and thermal properties of this alloy. The results of x-ray diffraction analysis show that the three alloys are multiphase. The structure of the Pd73B27 and Pt58B42 phases is unknown due to limited references. The Pd phase forms a cubic structure. The Pt phase has an FCC cubic structure, while the NiB phase forms an orthorhombic structure. The Boron phase in all three alloys forms a rhombohedral structure. The mass spectrometer results for the Pd73B27 alloy show that the [Pd**] ion has a mass number of 52 and the [Pd**] ion has two mass numbers, namely 110 and 1051, as well as for boron, namely 10 and 11. For the Pt58B42 alloy, the [Pt**] ion is formed with a mass number of 97.5 and [Pt**] 195. Meanwhile, the [B*] ion has a mass number of 10 and 11. Pt58B42 alloy shows three endothermic peaks in DTA (Differential Thermal Analysis) analysis. The I 6H enthalpy for the three peaks is -16107 j/g at the peak temperature of 127.99'C, -4.46 j/g at 182.96'C and -11107 j/g at 911.18'C. It is estimated that the third peak is the Pt58B42 phase. The Pd73B27 and NiB alloys have not shown good results. The material has a brittle appearance macroscopically. From the results of observations using SEM, it can be seen that there are flat grains, especially in the Pt58B42 alloy. The Pt58B42 and NiB alloys have greater hardness than the Pt58B42 alloy."

"This book offers readers comprehensive coverage of security policy specification using new policy languages, implementation of security policies in Systems-on-Chip (SoC) designs – current industrial practice, as well as emerging approaches to architecting SoC security policies and security policy verification. The authors focus on a promising security architecture for implementing security policies, which satisfies the goals of flexibility, verification, and upgradability from the ground up, including a plug-and-play hardware block in which all policy implementations are enclosed. Using this architecture, they discuss the ramifications of designing SoC security policies, including effects on non-functional properties (power/performance), debug, validation, and upgrade. The authors also describe a systematic approach for “hardware patching”, i.e., upgrading hardware implementations of security requirements safely, reliably, and securely in the field, meeting a critical need for diverse Internet of Things (IoT) devices.- Provides comprehensive coverage of SoC security requirements, security policies, languages, and security architecture for current and emerging computing devices;- Explodes myths and ambiguities in SoC security policy implementations, and provide a rigorous treatment of the subject;- Demonstrates a rigorous, step-by-step approach to developing a diversity of SoC security policies;- Introduces a rigorous, disciplined approach to “hardware patching”, i.e., secure technique for updating hardware functionality of computing devices in-field;- Includes discussion of current and emerging approaches for security policy verification."