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"This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed, also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures."

"This book discusses the prevalent practices and enabling techniques in the assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics covered include the bonding and sealing of microcomponents, the process flow of MEMS and microsystem packaging, automated microassembly, and testing and design for testing."

"Bolometers adalah termal inframerah sensor yang menyerap radiasi elektromagnetik sehingga meningkatkan suhu. Kenaikan suhu yang dihasilkan adalah kenaikan fungsi dari energi radiasi yang mendorong atau mengenai bolometer dan diukur berdasarkan resistansinya. Mikrobolometer dapat diartikan juga sebagai array dari sensor yang sangat sensitif dalam mendeteksi panas terhadap radiasi inframerah. Pada skripsi ini akan mensimulasikan satu pixel microbolometer dengan menggunakan program IntelliSuite. Mikrobolometer yang didisain akan digunakan sebagai alat inspeksi instalasi listrik, di dalam satu pixel mikrobolometer ini dilengkapi dengan thermistor NTC (Negative Temperature Coeficient), sedangkan rangkaian yang digunakan pada disain microbolometer ini yaitu rangkaian dengan menggunakan arus konstan.

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Bolometers are thermal infrared sensor that absorbs electromagnetic radiation thereby increasing the temperature. The resulting temperature increase is the increase in the function of the radiation energy that drives or the bolometer and the measured resistance. Microbolometer can be interpreted also as an array of sensors that are very sensitive in detecting the infrared heat radiation.

At this skripsi will simulate one pixel microbolometer using IntelliSuite program. Microbolometer which will be designed to be used as an electrical installation inspection, this microbolometer complete with a thermistor NTC (Negative Temperature coefficient),while the circuit used in the circuit design of this microbolometer using constant current."

"This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. The results of these studies have been reported rather sporadically at various technical conferences."

"Power electronic packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. The book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions."