Ditemukan 20 dokumen yang sesuai dengan query
v. 1. Properties and selection--irons, steels, and high-performance alloys -- v. 2. Properties and selection--nonferrous alloys and special-purpose materials -- v. 3. Alloy phase diagrams -- v. 4. Heat treating -- v. 5. Surface engineering-- v. 6. Welding, brazing, and soldering-- v. 7. Powder metal technologies and applications -- v....
Materials Park: ASM International, 1992
R 620.16 ASM a
Buku Referensi Universitas Indonesia Library
Metal Parks: American Society for Metals, 1989
R 669 ASM m XVI
Buku Referensi Universitas Indonesia Library
A text considering the various aspects of the application of image analysis to materials science problems, most especially engineering problems. A guide for applying image analysis to evaluate microstructural features in a variety of materials. Inlcudes bright, detailed color photographs and illustrations, as well as a wealth of black and...
Materials Park, OH: ASM International, 2000
e20442170
eBooks Universitas Indonesia Library
Contents :
- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging
Techniques in CMOS Failure Analysis
- Infrared Light Emission From Semiconductor Devices
- The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI
Circuits
-...
Materials Park, Ohio: ASM International, 1996
e20442490
eBooks Universitas Indonesia Library
In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution...
Materials Park, Ohio: ASM International, 2005
e20442491
eBooks Universitas Indonesia Library
Contents :
- Keynote Presentation
- Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That
an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup
- Session 1: Advanced Techniques
- Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in...
Materials Park, Ohio: ASM International, 1998
e20442507
eBooks Universitas Indonesia Library
Contents :
- Terahertz Imaging: A New Technique for Inspection of Dielectric Materials
- Detecting Power Shorts from Front and Backside of IC Packages Using Scanning
SQUID Microscopy
- Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing
- Optical Probing of VLSI IC’s from the...
Materials Park, Ohio: ASM International, 1999
e20442508
eBooks Universitas Indonesia Library
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and...
Materials Park, Ohio: ASM International, 2008
e20442550
eBooks Universitas Indonesia Library
Contents :
- Preface
- The Use of Ion Exchange Compounds as Corrosion Inhibiting and Sensing
Pigments in Organic Coatings
- A Novel Self-Priming Coating for Corrosion Protection
- SVET Investigations of Protection Mechanism of Mg-rich Primer on Al 2024
- Development of Ni-Si-Nb...
Materials Park, Ohio: ASM International, 2005
e20442577
eBooks Universitas Indonesia Library
Contents :
- IPFA 2002 Best Paper Award Winner
- SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of
Electronic Devices
- From Microns to Molecules–Can FA Remain Viable Through the Next Decade?
- Soft Defect Localization (SDL) on ICs
- Fault Localization and Functional...
Materials Park, Ohio: ASM International, 2002
e20442621
eBooks Universitas Indonesia Library
