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"v. 1. Properties and selection--irons, steels, and high-performance alloys -- v. 2. Properties and selection--nonferrous alloys and special-purpose materials -- v. 3. Alloy phase diagrams -- v. 4. Heat treating -- v. 5. Surface engineering-- v. 6. Welding, brazing, and soldering-- v. 7. Powder metal technologies and applications -- v. 8. Mechanical testing and evaluation -- v. 9. Metallography and microstructures -- v. 11. Failure analysis and prevention-- v. 15. Casting -- v. 19. Fatigue and fracture -- v. 20. Materials selection and design -- v. 21. Composites-- v. 23. Materials for medical devices"

"A text considering the various aspects of the application of image analysis to materials science problems, most especially engineering problems. A guide for applying image analysis to evaluate microstructural features in a variety of materials. Inlcudes bright, detailed color photographs and illustrations, as well as a wealth of black and white images. DLC: Metallography."

"Contents :- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging Techniques in CMOS Failure Analysis - Infrared Light Emission From Semiconductor Devices - The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI Circuits - Golden Devices II: Alchemy in the 0.35 um Era - Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip - Two Unique Case Studies Performed With Photoemission Microscopy (PEM) - Application of Photoemission Microscopy and Focused Ion Beam Microsurgery to an Investigation of Latchup - Localizing Heat-Generating Defects Using Fluorescent Microthermal Imaging - A User-Friendly System for Fluorescent Microthermal Imaging and Light Emission Microscopy - Fast, Clean and Low Damage Deprocessing Using Inductively Coupled and RIE Plasmas - X-Ray Microfocus Radioscopy and Computed Tomography for Failure Analysis - Low Resistivity FIB Depositions Within High Aspect Ratio Holes - Grains Observation Using FIB Anisotropic Etch Followed by AFM Imaging - Cross-Sectional Specimen Preparation of Fragile Failure Location in Thin-Film Transistors Using Focused Ion Beam Etching and Transmission Electron Microscope - Low Acceleration Voltage EBIC Using FESEM and Application to Cross- Sectional Junction Evaluation - Contamination Diagnosis Using Contamination-Defect-Fault (CDF) Simulation - FLOSPAT: Fault Localization by Sensitized Path Transformation - Fault Verification Simulation for Light-Emission Microscopy and Liquid-Crystal Analysis - Fault Diagnosis on the TMS320C80 (MVP) Using FastScanTM - Modeling IC Defects Using Circuit Simulation Software - Characterization of Unfilled Tungsten Plugs on a 0.35 um CMOS Multilevel Metallization Process - Failure Analysis of a Half-Micron CMOS IC Technology - Burn-in Failure Analysis of 0.5 um 1 MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug - The Application of Novel Failure Analysis Techniques and Defect Modeling in Eliminating Short Poly End-Cap Problem in Submicron CMOS Devices - Case Study: Unique Stress Induced Gate Oxide Defects in a CMOS Analog/Digital Device Revealed by Backside Silicon Removal - Risk Assessment in Signature Analysis - Signature Analysis: Statistical Models and Their Application to FA - A Signature Analysis Method for IC Failure Analysis - TEM Sample Preparation Using A Focused Ion Beam and A Probe Manipulator - Pin-Point Transmission Electron Microscopic Analysis Applied to Off-Leakage Failures of a Bipolar Transistor in 0.5 um BiCMOS Devices - TEM Cross-Sectional Analysis of ESD Induced Damage in Input Protection Circuitry - A Study of Measurement Methods for Detecting Voiding and Delamination of Die Attach Materials in Power Semiconductor Devices - Failure Analysis of the Die-Attach in a Metal-Type Package - Charge Diffusion and Reciprocity Theorems: A Direct Approach to EBIC of Ridge Laser Diodes - Characterization and Elimination of Forward Snapback Defects in GaAs Light Emitting Diodes - Temperature Dependence of Quiescent Currents as a Defect Prognosticator and Evaluation Tool - Contactless Testing of Pulse Propagation in IC's-A Comparison Between OBIC and Captive-Coupling Detection Techniques - Electron-Beam Analysis of the Turn-On Speed of Grounded-Gate NMOS ESD Protection Transistors During Charged Device-Model Stress Pulses - Contactless Function Test of Integrated Circuits on the Wafer - Package Related Failure Mechanisms in Plastic BGA Packages Used for ASIC Devices - Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy - Signature Analysis of Package Delamination Using Scanning Acoustic Microscope - A Case Study of Post De-Tape Cleans on Mold Compound Adhesion - Spatial Evaluation of Resolution in a Scanning Ultrasonic Microscope. Microassembling Technologies Characterization: Differences Between A-Scan and C-Scan Analysis Modes - Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards - A Review of Wet Etch Formulas for Silicon Semiconductor Failure Analysis 301 Carbon Coating for Electron Beam Testing and Focus Ion Beam Reconfiguration - A Technique for Achieving Precision Cross Sections of Released Surface Micromachined Structures - The Study of ESD Destructive Mechanism for PN-Junction - Interconnect Failure Dependence on Crystallographic Structure - Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures - Mechanism Study of Contact Corrosion in Unpatterned Metal Wafer - TPLY for Yield Improvement - A New Robust Backside Flip-Chip Probing Methodology "

"In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and overcomes some significant problems encountered with alternative resolution enhancing schemes"

"Contents :- Keynote Presentation - Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup - Session 1: Advanced Techniques - Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow Trench Isolation CMOS Structures: Correlation With Defect Generation and Diode Leakage - Microthermal Imaging Based on the Transmission Change of a Thermochromic Dye Film - High Spatial Resolution OBIRCH and OBIC Effects Realized by Near-Field Optical Probe in the Analysis of High Resistance 200 nm wide TiSi Line - Advanced Failure Analysis of Deep-Submicron CMOS Device Dopant Profiles Using Scanning Kelvin Probe Microscopy - Scanning Capacitance Microscopy use in the Failure Analysis of Vcc Shorts in an Advanced Microprocessor - Session 2: FIB I - Focused Ion Beam Irradiation Induced Damages on CMOS and Bipolar Technologies - AC Hot-Carrier Effects Characterization by Circuit Modification Using Focused Ion Beam - Performing Circuit Modification and Debugging Using Focused-Ion-Beam on Multi-Layered C4 Flip-Chip Devices - Focused Ion Beam Application in Solving RFIC Oscillation Problem - Session 3: Military - The RAC Data Sharing Consortium: Sharing Test, Field and Failure Analysis Data - Failure Analysis of a Qualification Unit Injector for a Satellite Thruster - Preliminary Study of Alternative Material Development of Ballistic Attributes - Metallurgical Examination of a Galled PH 13-8 Mo Stainless Steel Main Rotor Sub-Assembly - Effects of Prior Processing on the Performance of PH 13-8 Mo Stainless Steel - Session 4: FIB II - In-Situ Electrical Monitoring and Contactless Measurement Techniques for Enhanced FIB Modifications - The Challenges of FIB Chip Repair & Debug Assistance in the 0.25 um Copper Interconnect Millennium - A Selected Area Planar TEM (SAPTEM) Sample Preparation Procedure for Failure Analysis of Integrated Circuits - Session 5: ESD - ESD Induced Failures in Cermet Trim Potentiometers - Basic Physics in Color-Coded EOS Metallization Failures (Differentiating Between EOS and ESD) - ESD Induced Failure of an Internal MOSFET in a Mixed Signal IC due to Two Different Power Supplies - Session 6: Techniques I - An Effective and Practical Analysis Technique for Open Defect Isolation at IDD Leakage Failure by Observing Transient Photo Emission - Thermally Assisted Photoemission for CMOS Device Analysis - Non-Contact Probing of Integrated Circuits Using Electrostatic Force Sampling - Session 7: Case History I - A Hermetic Package Internal Water Vapor Paradox: Nonconforming Product That Does Not Fail - Graphical Representation of Permanent Defects in Hard Disk Drives - Evaluation of Pt/PZT/Pt Capacitors Using Sims - Session 8: Techniques II - Evaluation of the Resistance of Individual Si Die to Cracking - Aluminum Interconnect Response to Electrical Overstress - Identification of Charging Effects in Plasma-Enhanced TEOS Deposition with Non-Contact Test Techniques - Session 9: Case History II - Passive Voltage Contrast Technique for Rapid In-Line Characterization and Failure Isolation During Development of Deep-Submicron ASIC CMOS Technology - Failure Analysis Case Study of PALs Used in the Flight Control Circuitry of Paveway III Laser Guided Bombs - ATE Failure Isolation Methodologies for Failure Analysis, Design Debug and Yield Enhancement - Session 10: Testing - Realistic Database for Semiconductor Device Analysis - Auto-Fault-Locating-System for Mounting Boards - Faster Defect Localization with a New Development of IDDQ - Session 11: Case History III - A Study on Discolored Bondpads and Galvanic Corrosion - Investigation of High Via Resistance of a 0.25 um CMOS ASIC Technology - Electromigration in Gold Line of GaAs IC - Session 12: Poster Sessions - Investigations of Leakage Paths in Sub-0.35 um DRAM Products Using Advanced Focused Ion Beam Techniques - Non-Destructive Chemical Decapsulation Techniques for TBGA Package Devices - Techniques to Remove the C4 Die from a Ceramic Package - Simple Flip Chip Analysis Strategies - The Logic Mapper - Making the Most of the Internet for Failure Analysis - High-Yield and High-Throughput TEM Sample Preparation Using Focused Ion Beam Automation - Application of EMS Analysis to Failure in Cell Area of Memory Device - Session 13: Discretes - Reduced Device Life Caused by Flux Entrapment During the Construction Process - Mechanical/Plasma Decapsulation Method and Thermal Finite-Element Analysis Provide Explanation for SMB Zener Failures - Innovative Ap"

"Contents :- Terahertz Imaging: A New Technique for Inspection of Dielectric Materials - Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy - Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing - Optical Probing of VLSI IC’s from the Silicon Backside - Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache - Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits - Comparative TDR Analysis as a Packaging FA Tool - Light Emission Spectral Analysis: The Connection Between the Electric Field and the Spectrum - Temperature Profile Measurement and Failure Characterization of ESD Protection Devices Using Spectroscopic Photon Emission Microscopy and Raman Spectroscopy - Infrared Emission Spectroscopy as a Reliability Tool - Quantitative E-beam Probe for Valid High-Speed Measurements - Short High Voltage Stress for Design-to-Process Characterization - Automatic TEM Sample Preparation - Failure Analysis of Sub-Micron Semiconductor Integrated Circuit Using Backside Photon Emission Microscopy - Sample Preparation for Backside Failure Analysis Using Infrared Photoemission Microscopy - In-situ Use of an Optical Microscope for FIB Microsurgery of Planarized Devices - Investigation on the Corrosion of Cu Metallization in the Focused Ion Beam System Due to a low I2 Background - Tin Corrosion Induced by Corrosive De-Ionized (DI) Water - Latch-Up Induced Slit Voiding in Aluminum Metal Lines - Failure Analysis of Discolored Bondpads in Wafer Fabrication - Optimizing Contact Resistance at a Resistor/Conductor Interface via Thin Film Microanalysis and Process Design of Experiments - Failure Analysis of Plastic Packaged GaAs and AlGaAs/GaAs LEDs - A Technique for Measuring Device Temperature with High Accuracy in Accelerated Operational Life Tests - Temperature Measurement on Micromachined IR Bolometers Using an Infrared Microscope - Automated Translation of Final Test Programs to Inexpensive FA Testers - FMECA Modeling-A New Approach - Selective Au-Etching on Aged GaAs-Based Devices - Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination - Evacuated FM08 Fuses Carry a Sustained Arc in a Bus over 75 VDC - Advanced Statistical Tools for Improving Yield and Reliability - An Application of Passive Voltage Contrast (PVC) to Failure Analysis of CMOS LSIs Using Secondary Electron Collection - Integrated Circuit Device Repair Using FIB system: Tips, Tricks, And Strategies - Modeling and Optimizing XeF2-Enhanced FIB Milling of Silicon - Reliability Test Results for Pt FIB Interconnect Structures - Focused Ion Beam Induced Effects on MOS Transistor Parameters - Relay Failures Specific to Space Applications - Failure Analysis of Autoclave-Stressed SRAMs with Aluminum Fuses - Electrostatic-Discharge (ESD) Failures in Thin-Film Resistors - Characterization of Gold Embrittlement in Solder Joints - In-situ Dual Beam (FIBSEM) Techniques for Probe Pad Deposition and Dielectric Integrity Inspection in 0.2 μm Technology DRAM - Die Backside FIB Preparation for Identification and Characterization of Metal Voids - FIB Micromachining and Nano-Structure Fabrication - Characterization and Fault Identification of Copper BEOL Sub 0.25 um Six Level Metal Microprocessor Designs - Analysis Of Ohmic Contact Metal Deposition Using FIB/SEM For A GaAs MESFET Clock Buffer IC Device - Identification of Subtle Isb Failure Mechanisms - Investigation of High Frequency Failures on a 0.35 um CMOS IC - BGA and Advanced Package Wire to Wire Bonding for Backside Emission Microscopy - Current-Signature-Based Analysis of Complex Test Fails - New Techniques for Logic Fault Diagnosis with a Case Study on the 440 BX Chipset - Electromigration and Electrochemical Reaction Mixed Failure Mechanism in Gold Interconnection System - Identification of Yield-Limiting Defects in a 0.5 Micron, Shallow Trench Isolation Technology - Visualization of Local Gate Depletion in PMOSFETs Using Unique Backside Etching and Selective Etching Technique - Residual Photoresist Identified as Cause for Frequency-Dependent Signal-to- Noise Failure After Autoclave Stress Testing - From IDDQ Fault Detection to Defect Localization in Logic CMOS Integrated Circuits: Key Issues - Recent Advances in Broad Ion Beam Techniques/Instrumentation for SEM Specimen Preparation of Semiconductors - A New Focused-Ion-Beam Microsampling Technique for TEM Observation of Site-specific Area’s - A Combined Infrared/Visible Photoemission Microscope - Correlation of Electronic and Thermal Properties of - Index"

"This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results."

"Contents : - Preface - The Use of Ion Exchange Compounds as Corrosion Inhibiting and Sensing Pigments in Organic Coatings - A Novel Self-Priming Coating for Corrosion Protection - SVET Investigations of Protection Mechanism of Mg-rich Primer on Al 2024 - Development of Ni-Si-Nb APS Coatings for Sulfuric Acid Resistance - Salt Fog Corrosion Testing of Al-Y-Co based Nanocrystalline and Amorphous Coatings Produced by Atmospheric Plasma Spray - Advancements In Artificial Heart Valve Disks Using Nanoscale Thin Films Deposited By CVD and Sol-gel Techniques - Nucleation Studies of Pulsed Bias Enhanced CVD on Biomaterials - Machining Cancellous Bone Using Coated Cutting Tools - Novel Diamond Coated Burs for Dental Drilling Applications - Immobilization of Doxorubicin on Surfaces of Plasma Synthesized C/Fe and C/Fe/N Magnetic Nanoparticles for Targeted Drug Delivery - Developments in CVD of Dental Tools - Aspects of Deposition and Characterization - Experimental and Gas-Phase Modeling of Nanocrystalline Diamond Films Grown by Hot Filament Chemical Vapor Deposition - Deposition of Polycrystalline Diamond Films on High Speed Steel Using TiN Interlayers - Micro/Nanotribological Behavior of Interfaces in Total Replacement Joints - Effect of Gas Composition on Sputtered TiCN Coatings - MAX, an Innovative Solution for Measuring Stresses in Hard-to-Access Locations - Surface Engineering for Improved Tribological Properties of Forming Tools - Influence of High Pressure Water-Jet Assisted Turning on Surface Residual Stresses on Ti-6AL-4V Alloy by Measurement and Finite Element Simulation - Optimization of Thermally Sprayed Metallic Nanocomposite Coatings - Self-Protective Boronizing Paste for Surface Treatment of Steel and Cast Iron - Tribological Behaviour of Diamond/HSS Couple : An Experimental and Numerical Study - Creation of Various Diffusion Protective Coatings on Steel Parts by New Scanning Liquid Induction Carburizing (LINCARBTM) Technology - Effect of Nickel Nano-Interlayers on the Property of CrN Coated Steels - Pulsed Electrodeposition of Organofunctional Silanes for Imroved Corrosion Protection of Aluminum Alloys - Microstructure and Process Induced Residual Stresses of Laser Clad CPM-9V and CPM-10V Tool Steels - Plasma Modification of Rutile TiO2 for Improved Photoreactivity - New Effective and Inexpensive Patented Method for Rapid Creation of Corrosion Resistant Surface Layer on Inexpensive Iron-Based Alloys - A quest for a Protective Liner Against Steam Oxidation at High Temperature. - Development of a Novel DC Plasma Source for Coating and Surface Modification Under Atmospheric Pressure. - A Comparison of EBPVD and Thermal Spray Thermal Barrier Coating Systems - New & Affordable Technical Solutions for Turbine Component Coatings - Investigation of Micro/Nanoscale Friction Behavior of Grafted Poly- (Nisopropylacrylamide) on Silicon - Nanotribological Properties of Nanocomposite CrBN and TiBN Thin Films - P.R.I.M.E. Surface Coating - A Novel Technique of Applying Thick Ceramic Coatings - Development and Characterization of Near Friction Less Carbon Coatings using a Large Area Filtered Arc Deposition System - Friction and Wear Characteristics of a Modified Composite Solid Lubricant Plasma Spray Coating - Hybrid Deposition Methods for Nanocomposite Coating Growth - Deposition of Nanocrystalline Diamond Using A New Film Growth Regime - Nano-engineered, Nanocomposite PVD Coatings for Superior Tribological Properties - Magnetron Sputtered Nc-TiC/a-C Nanocomposite Coatings: Processing, Characterization and Properties - Effect of Substrate Bias on Sputtered TiN Coatings - Greening of Cleaning: Renewable Feed-Stock Alternatives in Surface Cleaning Bio-Based Alternative Solvents: How Well Do They Work - Review of Thermally Sprayed Thermal Barrier Coatings - Initiation and Growth of Delamination Cracks in Vacuum Plasma Sprayed Thermal Barrier Coatings - Thermal Conductivity of Plasma and EBPVD Thermal Barrier Coatings - Laser-based Inspection of Thermal Barrier Coatings - Study of the Relationships Between Processing Parameters, Microstructure and Properties of Ni-Based Plasma Sprayed Thermal Coatings - Sinter-Brazing of Carbides to P/M Steel - The Surface Morphology of Rubber Compounds Studied by AFM - Side Laser Cladding Deposition and Residual Stress in a Co-based Layer on Steel - Characterization of (111) and (100) Textured CVD Diamond Sheets Using FTIR spectroscopy - Growth and Characterization of N-doped Polycrystalline Diamond Films - Author Index - Keyword Index "

"Contents :- Recent Developments in the Understanding of Stainless Steel Welding Metallurgy - Tailoring the Phase Balance During Laser and GTA Keyhole Welding of SAF 2205 Duplex Stainless Steel - Pitting Corrosion Resistance of Duplex Stainless Steels Multipass Welds - Investigation of the Kinetics of the Ferrite/Austenite Phase Transformation in the HAZ of a 2205 Duplex Stainless Steel Weldment - Effect of GTAW Flux on the Microstructure and Properties of Austenitic, Super Austenitic and Super Duplex Stainless Steel Welds - COlumnar-to-Equiaxed Transition During Solidification of Steel Welds - Analysis of Autogenous Gas Tungsten Arc and Laser Welding of Superaustenitic Stainless Steels for Naval Combatant Hulls - Laser Welding of Superaustenitic Stainless Steel - Prediction of Solidification Mode and Hot Cracking Susceptibility in Laser Welds of High Nitrogen Stainless Steels - HAZ Properties of High Nitrogen Austenitic Stainless Steel - Ductility-Dip Cracking Susceptibility of Austenitic Alloys - Fatigue Crack Propagation of Stainless Steel Welds - Hot Cracking Resistance of Laser and Hybrid Welded Austenitic Stainless Steels - Improved Models for Predicting Ferrite Content in Stainless Steel Welds - Progress in Joining Austenitic Stainless Steels by Friction Stir Welding - Effect of Twin-Induced Grain Boundary Engineering on Intergranular Corrosion in Austenitic Stainless Steel - Effect of CTE on Fatigue Cracking of Stainless Steel Vessels - Recent Developments in Transport Phenomena in Fusion Welding - Laser Weld Keyhole Dynamics - Computer Modeling of Keyhole Mode Laser Welding to Avoid Macro-porosity - Dimensionless Relationships for the Keyhole Weld Characteristics in AZ80 Magnesium Alloy - Numerical Modeling of Stationary GTA Welding - Validation of Computed Weld Pool Temperature Profiles for GTA Welding of Gamma TiAl - Anode Heat Transfer in GTA Welding - A k-E Model for Turbulent Weld Pool Convection in Gas Metal Arc Welding Process - Analysis of Friction Stir Weld Using the Inverse-Problem Approach - Phase Distribution and Transformation Dynamics in Fusion Welds Using In-situ Synchrotron Diffraction Methods - Advanced Characterization Techniques for Weld Microstructures - Nonequilibrium solidification in Fe-C-Al-Mn steel welds - Mapping Phase Transformations in the Heat-Affected-Zone of Carbon Manganese Steel Welds Using Spatially Resolved X-Ray Diffraction - Modeling of Ferrite to Austenite Transformation and Real Time Mapping of Phases During GTA Welding of 1005 Steel - Magnetic Force Microscopy as a Tool for Weld Metal Studies - Characterization of Delta Ferrite Content in GTAW Deposited Stainless Steel Cladding - Grain Growth in the Heat-Affected Zone of Ti-6Al-4V Welds: Measurements and Three Dimensional Monte Carlo Simulation - Friction Stir Welding Developments - A Detailed Three-Dimensional Transient Heat Transfer Model For Friction Stir Welding - Input Torque Based Thermal Model of Friction Stir Welding of Al-6061 - High-Speed Video Flow Visualization in Friction Stir Welds of Polycarbonate - Visualization of Material Flow During Friction Stir Welding (FSW) of the Same and Dissimilar Aluminum Alloys - Force Sensing in Friction Stir Welding - Microstructural Analysis and Modeling of the Heat Affected Zone in Al 2519 Friction Stir Welds - Thermo-Mechanicat Anatyses of Wetding Atuminium Alloy with TIG and Friction Stir Welding - Residual Stress Distributions in Friction Stir Welded Al Sheets Determined by Neutron Strain Scanning - Effect of Pin Tool Shape on Metal Flow During Friction Stir Welding - Reproduction of Ultra-Fine Grains in Equal Channel Angular Pressed Al Alloy by Friction Stir Process - Improvement of Mechanical Properties in Thixomolded Mg Alloy AZ91D by Friction Stir Welding - The Evaluation of the Mechanical Properties of AA5083 Friction Stir Welds by Electronic Speckle Pattern Interferometry - Investigating Post-Weld Heat Treatments to Increase the Corrosion and the Environmental Cracking Behavior of 7075-T6 Friction Stir Weld - Pitting Corrosion Behavior of Friction Stir Welded 7050-T74 Aluminum Alloy - The Effect of the Welding Conditions on the Nugget Zone in Friction Stir Welds in an AA7010 Alloy - Metallurgical Characterization of Friction Stir Welded 7050-T74 and C458-T3 Aluminum Alloys - Weld Efficiency and Defect Formation: Correlation Between Experiment and Simple Models - Low Plasticity Burnishing of Friction Stir Welds in 2219 Aluminum to Increase Corrosion Fatigue Life - Mechanical Property and Microstructural Evaluation of Friction Stir Welded AL- 6XN - Post-Weld Aging of Friction Stir Wel"