Ditemukan 10 dokumen yang sesuai dengan query
Contents :
- Testing-Based Failure Analysis: A Critical Component of the SIA Roadmap Vision
- Experimental Figures for the Defect Coverage of IDDQVectors
- A CAD-Based Approach to Failure Diagnosis of CMOSLSI with Single Fault
Using Abnormal IDDQ
- Test and Failure Analysis Implications of a Novel...
Materials Park, Ohio: ASM International, 1997
e20442506
eBooks Universitas Indonesia Library
Contents :
- Keynote Presentation
- Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That
an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup
- Session 1: Advanced Techniques
- Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in...
Materials Park, Ohio: ASM International, 1998
e20442507
eBooks Universitas Indonesia Library
Contents :
- Terahertz Imaging: A New Technique for Inspection of Dielectric Materials
- Detecting Power Shorts from Front and Backside of IC Packages Using Scanning
SQUID Microscopy
- Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing
- Optical Probing of VLSI IC’s from the...
Materials Park, Ohio: ASM International, 1999
e20442508
eBooks Universitas Indonesia Library
In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution...
Materials Park, Ohio: ASM International, 2005
e20442491
eBooks Universitas Indonesia Library
Contents :
- Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip
Packaged Microprocessors
- Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis &
Microcharacterisation
- Application of Single Contact Optical Beam Induced Currents (SCOBIC) for
Backside Failure Analysis...
Materials Park, Ohio: AsM International, 2000
e20442548
eBooks Universitas Indonesia Library
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and...
Materials Park, Ohio: ASM International, 2008
e20442550
eBooks Universitas Indonesia Library
Contents :
- IPFA 2002 Best Paper Award Winner
- SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of
Electronic Devices
- From Microns to Molecules–Can FA Remain Viable Through the Next Decade?
- Soft Defect Localization (SDL) on ICs
- Fault Localization and Functional...
Materials Park, Ohio: ASM International, 2002
e20442621
eBooks Universitas Indonesia Library
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and...
Materials Park, Ohio: ASM International, 2010
e20451716
eBooks Universitas Indonesia Library
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand and eliminate electronic device and system failures...
Materials Park, Ohio: ASM International, 2006
e20451852
eBooks Universitas Indonesia Library
Contents :
- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging
Techniques in CMOS Failure Analysis
- Infrared Light Emission From Semiconductor Devices
- The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI
Circuits
-...
Materials Park, Ohio: ASM International, 1996
e20442490
eBooks Universitas Indonesia Library
