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Abstrak :
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.

Abstrak :
Contents : - A Comparitive Study of Electron and Ion Beam Induced Charge Imaging Techniques in CMOS Failure Analysis - Infrared Light Emission From Semiconductor Devices - The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI Circuits - Golden Devices II: Alchemy in the 0.35 um Era - Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip - Two Unique Case Studies Performed With Photoemission Microscopy (PEM) - Application of Photoemission Microscopy and Focused Ion Beam Microsurgery to an Investigation of Latchup - Localizing Heat-Generating Defects Using Fluorescent Microthermal Imaging - A User-Friendly System for Fluorescent Microthermal Imaging and Light Emission Microscopy - Fast, Clean and Low Damage Deprocessing Using Inductively Coupled and RIE Plasmas - X-Ray Microfocus Radioscopy and Computed Tomography for Failure Analysis - Low Resistivity FIB Depositions Within High Aspect Ratio Holes - Grains Observation Using FIB Anisotropic Etch Followed by AFM Imaging - Cross-Sectional Specimen Preparation of Fragile Failure Location in Thin-Film Transistors Using Focused Ion Beam Etching and Transmission Electron Microscope - Low Acceleration Voltage EBIC Using FESEM and Application to Cross- Sectional Junction Evaluation - Contamination Diagnosis Using Contamination-Defect-Fault (CDF) Simulation - FLOSPAT: Fault Localization by Sensitized Path Transformation - Fault Verification Simulation for Light-Emission Microscopy and Liquid-Crystal Analysis - Fault Diagnosis on the TMS320C80 (MVP) Using FastScanTM - Modeling IC Defects Using Circuit Simulation Software - Characterization of Unfilled Tungsten Plugs on a 0.35 um CMOS Multilevel Metallization Process - Failure Analysis of a Half-Micron CMOS IC Technology - Burn-in Failure Analysis of 0.5 um 1 MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug - The Application of Novel Failure Analysis Techniques and Defect Modeling in Eliminating Short Poly End-Cap Problem in Submicron CMOS Devices - Case Study: Unique Stress Induced Gate Oxide Defects in a CMOS Analog/Digital Device Revealed by Backside Silicon Removal - Risk Assessment in Signature Analysis - Signature Analysis: Statistical Models and Their Application to FA - A Signature Analysis Method for IC Failure Analysis - TEM Sample Preparation Using A Focused Ion Beam and A Probe Manipulator - Pin-Point Transmission Electron Microscopic Analysis Applied to Off-Leakage Failures of a Bipolar Transistor in 0.5 um BiCMOS Devices - TEM Cross-Sectional Analysis of ESD Induced Damage in Input Protection Circuitry - A Study of Measurement Methods for Detecting Voiding and Delamination of Die Attach Materials in Power Semiconductor Devices - Failure Analysis of the Die-Attach in a Metal-Type Package - Charge Diffusion and Reciprocity Theorems: A Direct Approach to EBIC of Ridge Laser Diodes - Characterization and Elimination of Forward Snapback Defects in GaAs Light Emitting Diodes - Temperature Dependence of Quiescent Currents as a Defect Prognosticator and Evaluation Tool - Contactless Testing of Pulse Propagation in IC's-A Comparison Between OBIC and Captive-Coupling Detection Techniques - Electron-Beam Analysis of the Turn-On Speed of Grounded-Gate NMOS ESD Protection Transistors During Charged Device-Model Stress Pulses - Contactless Function Test of Integrated Circuits on the Wafer - Package Related Failure Mechanisms in Plastic BGA Packages Used for ASIC Devices - Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy - Signature Analysis of Package Delamination Using Scanning Acoustic Microscope - A Case Study of Post De-Tape Cleans on Mold Compound Adhesion - Spatial Evaluation of Resolution in a Scanning Ultrasonic Microscope. Microassembling Technologies Characterization: Differences Between A-Scan and C-Scan Analysis Modes - Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards - A Review of Wet Etch Formulas for Silicon Semiconductor Failure Analysis 301 Carbon Coating for Electron Beam Testing and Focus Ion Beam Reconfiguration - A Technique for Achieving Precision Cross Sections of Released Surface Micromachined Structures - The Study of ESD Destructive Mechanism for PN-Junction - Interconnect Failure Dependence on Crystallographic Structure - Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures - Mechanism Study of Contact Corrosion in Unpatterned Metal Wafer - TPLY for Yield Improvement - A New Robust Backside Flip-Chip Probing Methodology

Abstrak :
In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and overcomes some significant problems encountered with alternative resolution enhancing schemes

Abstrak :
This major reference book is aimed at engineers and technical managers concerned with EMC (electromagnetic compatibility). It explains why EMC testing is necessary, what standards must be met, how such testing is carried out (and therefore how to prepare for it), what accuracy and repeatability can be expected, and when to test. For less than the cost of half a day's testing in a laboratory, with this book manufacturers of equipment can prepare for and interact with test houses on the basis of sound knowledge; thereby reducing the time and expense incurred prior to EMC approval.

Abstrak :
Contents : - Foreword - The Microelectronics Desk Reference - System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in today’s High Speed Low Cost PC environment - Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products - Failure Analysis Flow for Package Failures - Wafer Level Failure Analysis Process Flow - Flip-Chip and “Backside” Sample Preparation Techniques - Failure Analysis in a Fabless/Outsourced World - Circuit Edit at First Silicon - The Process of Editing Circuits Through the Bulk Silicon - Curve Tracer Data Interpretation for Failure Analysis - A Primer on Simple Device Problems and Curve Tracer Characteristics - Electronics and Failure Analysis - Analog Device and Circuit Characterization - IC Testing: Background, Directions and Opportunities for Failure Analysis - Using Scan Based Techniques for Fault Isolation in Logic Devices - The Power of Semiconductor Memory Failure Signature Analysis - Common Defects Encountered During Semiconductor Manufacturing - System Level Board Fabrication and Assembly Process Anomalies and Associated Failures Categories - Characterization of Anomalies in Flip-Chip Solder Joins in Ceramic Packaging - Identification of Latent Defects in Advanced Glass Ceramic MCM Packaging - Electrostatic Discharge (ESD) and Latchup Failures in Advanced CMOS Technologies - Electrical and Optical Characterization of Latchup - Failure Analysis of Microelectromechanical Systems (MEMS) - Failure Analysis of Passive Components - Failure Analysis and Reliability of Optoelectronic Devices - Die-level Fault Localization with X-ray Microscopy - X-ray Microtomography Tools for Advanced IC Packaging Failure Analysis - Acoustic Microscopy of Semiconductor Packages - Electronic Package Fault Isolation Using TDR - Current Imaging using Magnetic Field Sensors - Chip access techniques - Low Stress FA Sample Preparation of Flip Chip Devices with Low-K Dielectric Interconnect Layers - Plastic BGA Module FA Process Flow Development - Chip-Scale Packages and Their Failure Analysis Challenges - Backside Analysis Using Re-Package Techniques - Photon Emission Microscopy - Fundamentals of Photon Emission (PEM) in Silicon – Electroluminescence for Analysis of Electronic Circuit and Device Functionality - Picosecond Imaging Circuit Analysis – PICA - Thermal Defect Detection Techniques - Thermal Failure Analysis by IR Lock-in Thermography - Beam-Based Defect Localization Methods - Principles of Thermal Laser Stimulation Techniques - Introduction to Laser Voltage Probing (LVP) of Integrated Circuits - SEM and FIB Passive Voltage Contrast - Electron Beam Probing - Delayerimg Techniques: Dry Processes Wet Chemical Processing and Parallel Lapping - Plasma Delayering of Integrated Circuits - The Art of Cross Sectioning - Delineation Etching of Semiconductor Cross Sections - Special Techniques for Backside Deprocessing - Deprocessing Techniques for Copper, Low K, and Soi Devices - PCB SMT Solder Joint Failure Analysis - Improved Methodologies for Identifying Root-Cause of Printed Board Failures - Optical Microscopy - Scanning Electron Microscopy - Ultra-high Resolution in the Scanning Electron Microscope - Focused Ion Beam (FIB) Systems: A Brief Overview - Transmission Electron Microscopy for Failure Analysis of Integrated Circuits - Atomic Force Microscopy: Modes and Analytical Techniques with Scanning Probe Microscopy - Energy Dispersive X-ray Analysis - Analysis of Submicron Defects by Auger Electron Spectroscopy (AES) - SIMS Solutions for Next Generation IC Processes and Devices - Submicron CMOS Devices - Reliability and Quality Concepts for Failure Analysts - CAD Navigation in FA and Design/Test Data for Fast Fault Isolation - Best of the EDFAS Email Discussion Forum 2000-2004 - Failure Analysis Roadmaps - Assembly Analytical Forum Analytical Tool Roadmap ISTFA 2003 Rev 0 White Paper - Education and Training for the Analyst - Managing the Unpredictable – A Business Model for Failure Analysis Service - Management Principles and Practices for the Failure Analysis Laboratory - Failure Analysis Terms and Definitions - JEDEC Standards for Failure Analysis - Education/Training Sources and References - ISTFA Subject Index

Abstrak :
Contents : - Microelectronics failure analysis desk reference, 2001 supplement - Preface - Microelectronic Failure Analysis Desk Reference 2001 Supplement - FIB Backside Isolation Techniques - The SEM Lab, From Laboratory Logistics to Final Sample Preparation Techniques for SEM Analysis of Semiconductors - Cross Sectioning with a Pivoting Sample Block - Focused Ion Beam Cross Sectioning as a Compliment or an Alternative to Conventional Mechanical Sectioning Techniques - Alternatives to Cross-Sectional Simple Preparation for Package and Board-Level Failure Analysis - Automation To Boost Productivity And Increase Repeatability: (A Sampling of Available Tools and Vendors) - Multi-Functional, Semi-Automatic Sample Preparation for Failure Analysis - SMPT©-Sub-Micron Polishing Technology For Automated Sample Preparation - Automated Techniques For SEM And TEM Sample Preparation - Sample Preparation Techniques for Site-Specific Cross-Sectional Analysis of High-Aspect-Ratio FIB Repair Sites - Deprocessing, Cross-Sectioning and FIB Circuit Modification of Parts Having Copper Metallization - Scanning Capacitance Microscopy of Junction and Non-Junction Samples - Electrical Probing of Deep Sub-Micron Integrated Circuits Using Scanning Probe Techniques - Application of Tunneling Atomic Force Microscopy (TUNA) to Failure Analysis - GoFATA: Glossary of Failure Analysis Tool Acronyms - ISTFA Subject Index

Abstrak :
Contents - IPFA 2000 Best Paper Award Winner - Application of Focused Ion Beam System as a Defect Localization and Root Cause Analysis Tool - Session 1: Advanced Techniques 1 - X-Ray Tomography of Integrated Circuit Interconnects: Past and Future - X-ray Nanotomog Raphy (XRMT) Tool for Non-Destructive High-Resolution Imaging of ICs - Single Point PICA Probing with an Avalanche Photo-Diode - Session 2: Advanced Techniques 2 - Comparison of Laser and Emission Based Optical Probe Techniques - Resistive Interconnection Localization - Optical Waveform Probing–Strategies for Non-Flipchip Devices and Other Applications - Advanced LIVA/TIVA Techniques - Session 3: Packaging - Super-conducting Quantum Interference Device Technique: 3-D Localization of a Short Within a Flip Chip Assembly - Integration of SQUID Microscopy into FA Flow - Evaluation of alternative Preparation Methods for Failure Analysis at modern Chip-and Package Technologies - TDR Analysis of Advanced Microprocessors - Signal Trace and Power Plane Shorts Fault Isolation Using TDR - Session 4: Poster Session - Backside Etch: A New FA Technique for Gate Oxide Pinhole and Si Defect Identification for Power IC Devices - Fabrication Of Inexpensive Decapsulation Fixtures for Small or Unique Plastic Packages - Failure Analysis of Plasma-Induced Submicron CMOS IC Yield Loss by Backside Photoemission Microscopy - Failure Types & Analysis In Cu Process Development of Design-Rule 0.18 μm CPU - TEM Examination of a Specified Site Identified by X-SEM in Microelectronics Failure Analysis - Design Debug and Design Fix Verification in a Failure Analysis Lab for a RF/IF Circuit for Cellular Applications With High Battery Save and Electrostatic Discharge Leakage: A Case Study - Self Aligned Contact Wordline-Bitline Shorts in Memory ICs–a Comparative Study of a Failure Mode, Its Root Causes, And Simple, But Highly Effective Analysis Techniques - A Spatial Filtering Localisation Tool for Failure Analysis of Periodic Circuits - New Manifestation of Electrical Overstress in Advanced Device Technologies - Session 5: Backside 1 - Implementing Thermal Laser Stimulation in a Failure Analysis Laboratory - Calibration Technique for MCT FPA used for Backside Emission Microsopy - Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors - New Signal Detection Methods for Thermal Beam Induced Phenomenon - CNC Milling and Polishing Techniques for Backside Sample Preparation - Session 6: SPM - Characterization of MOS Devices by Scanning Thermal Microscopy (SThM) - Contactless Failure Analysis of Integrated Circuits Via Current Contrast Imaging with Magnetic Force Microscopy - Multiple Probe Deep Sub-Micron Electrical Measurements Using Leading Edge Micro-Machined Scanning Probes - Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects - Session 7: Backside 2 - Emission Microscopy and Thermal Laser Stimulation for Backside Failure Localization - CMOS Front-End Investigation over Large Areas by Deprocessing from the Back Side - New Techniques for the Identification of Defects in Multi-Layer Flip-Chip Packages - Session 8: Case Histories 1 - Board Level Failure Analysis of Chip Scale Packages - IC Failure by Electrical Overstress (EOS) - The Search for the Elusive EOS Monster - Session 9: FIB - Effect of Ga Staining due to FIB Editing on IR Imaging of Flip Chips - Water Vapor Enhancement for Elemental Analysis Using Focused Ion Beam Secondary Ion Mass Spectrometry (FIB-SIMS) - Various Focused Ion Beam Microsurgery Techniques in Dealing with Copper Metalization in ICs - Reliability of Bipolar and MOS Circuits After FIB Modification - Mass Production Cross-Section Tem Samples by Focus Ion Beam Masking and Reactive Ion Etching - Session 10: Case Histories 2 - A Successful Failure Analysis Using Front and Backside Fault Localization Techniques on a Deep Sub-Micron CMOS Device - Use of STEM in Nanometer Level Defect Analysis of SRAM Devices - A New Deprocessing Technique By Selective Wet-Etch Of Passivation And Inter Metal Dielectric Layers For Submicron Devices - SRAM Failure Analysis Flow - Physical Failure Analysis on Vertical Dielectric Films - Session 11: MEMS - Design for Reliability of MEMS/MOEMS for Lightwave Telecommunications - Mechanical Characterization of Materials Used in MEMS - Optical Imaging of High-Frequency Resonances and Semi-Static Deformations in Micro-Elec