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Ditemukan 12 dokumen yang sesuai dengan query
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Processing of electronic materials / editors, Clarence G. Law and Richard Poliard
New York: American Institute of Chemical Engineers, [1987]
621.381 PRO p
Buku Teks  Universitas Indonesia Library
cover
Electronic materials handbook : volume 1 packaging
Buku yang berjudul "Electronic materials handbook : volume 1 packaging" ini merupakan sebuah buku panduan mengenai material elektronik...
[Place of publication not identified]: ASM International, 1989
R 621.381 ELE I
Buku Referensi  Universitas Indonesia Library
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Colclaser, Roy A., author
Materials and devices for electronical engineering and physicist / Roy A Colclaser. Sherra Diehl-Nagle.
New York:: McGraw-Hill, 1985
621.381 COL m
Buku Teks  Universitas Indonesia Library
cover
Journal of materials science: materials in electronics
London: Chapman & Hall, 2018
537 JMS
Majalah, Jurnal, Buletin  Universitas Indonesia Library
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Electronic materials and processes handbook/editor Charles A. Harper; Ronald N. Sampson
New York: McGraw-Hill, 1994
621.381 ELE
Buku Teks  Universitas Indonesia Library
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ISTFA '96: proceedings of the 22nd international symposium for testing and failure analysis ,18 - 22 November 1996, Los Angeles, California
Contents : - A Comparitive Study of Electron and Ion Beam Induced Charge Imaging Techniques in CMOS Failure Analysis - Infrared Light Emission From Semiconductor Devices - The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI Circuits -...
Materials Park, Ohio: ASM International, 1996
e20442490
eBooks  Universitas Indonesia Library
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ISTFA 2005: Proceedings of the 31st International Symposium for Testing and Failure Analysis, November 6-10, 2005, McEnery Convention Center, San Jose, California
In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution...
Materials Park, Ohio: ASM International, 2005
e20442491
eBooks  Universitas Indonesia Library
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ISTFA '97: proceedings of the 23rd International Symposium for Testing and Failure Analysis, 27-31 October 1997, Santa Clara Convention Center, Santa Clara, California
Contents : - Testing-Based Failure Analysis: A Critical Component of the SIA Roadmap Vision - Experimental Figures for the Defect Coverage of IDDQVectors - A CAD-Based Approach to Failure Diagnosis of CMOSLSI with Single Fault Using Abnormal IDDQ - Test and Failure Analysis Implications of a Novel...
Materials Park, Ohio: ASM International, 1997
e20442506
eBooks  Universitas Indonesia Library
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ISTFA '98: proceedings of the 24th International Symposium for Testing and Failure Analysis, 15-19 November 1998, Hyatt Regency DFW, Dallas, Texas
Contents : - Keynote Presentation - Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup - Session 1: Advanced Techniques - Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in...
Materials Park, Ohio: ASM International, 1998
e20442507
eBooks  Universitas Indonesia Library
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ISTFA '99: proceedings of the 25th international symposium for testing and failure analysis, 14-18 November 1999, Westin Hotel Santa Clara, California
Contents : - Terahertz Imaging: A New Technique for Inspection of Dielectric Materials - Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy - Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing - Optical Probing of VLSI IC’s from the...
Materials Park, Ohio: ASM International, 1999
e20442508
eBooks  Universitas Indonesia Library
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