Ditemukan 1 dokumen yang sesuai dengan query
Yudan Whulanza, author
This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where...
Depok: Faculty of Engineering, Universitas Indonesia, 2015
UI-IJTECH 6:6 (2015)
Artikel Jurnal Universitas Indonesia Library
