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"This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results."

"Contents :- Session 1: Advanced Techniques - Scanning Magnetoresistive Microscopy for Die-Level Sub-Micron Current Density Mapping - High Resolution Current Imaging by Direct Magnetic Field Sensing - Fault Isolation of High Resistance Defects using Comparative Magnetic Field Imaging - High Resolution Backside Thermography using a Numerical Aperture Increasing Lens - Session 2: Optical Techniques - Study of Critical Factors Determining Latchup Sensitivity of ICs using Emission Microscopy - New Applications of Thermal Laser Signal Injection Microscopy (T-LSIM) - PC Card Based Optical Probing of Advanced Graphics Processor using Time Resolved Emission - Time-Resolved Optical Measurements from 0.13μm CMOS Technology Microprocessor using a Superconducting Single-Photon Detector - IC Diagnostic with Time Resolved Photon Emission and CAD Auto-channeling - Session 3: Package Level Analysis 1 - 3D X-ray Computed Tomography (CT) for Electronic Packages - High-Angle Electron Microscopy Technique for Analysis of Thin Film Contamination on IC Package Exteriors - Solder Bump Defects in Ceramic Flip Chip Packages and Their Acoustic Signatures. - Copper Bond over Active Circuit (BOAC) and Copper over Anything (COA) Failure Analysis - Investigation of Bond-pad Related Inter-metal Dielectric Crack - Session 4: Sample Preparation 1 - Enhanced SEM Doping Contrast - Interconnect and Gate Level Delayering Techniques for Cu/Low k Technology Failure Analysis - Backside Deprocessing of CMOS SOI Devices for Physical Defect and Failure Analysis - A Novel Approach to Front-side Deprocessing for Thinned Die after Backside Failure Isolation - Session 5: System Level Analysis - Dynamic Infrared System Level Fault Isolation - X-ray Laminography Benchmarking and Failure Analysis of Solder Joint Interfaces - XRF Correlation of Board Reseats due to Intermittent Failures from the use of Thin Gold Plating finish on the Contact Fingers - Session 6: Metrology and Materials Analysis 1 - Deal Time SEM Imaging of FIB Milling Processes for Extended Accuracy on TEM Samples for EFTEM Analysis - A Method for Exact Determination of Dram Deep Trench Surface Area - A Review of TEM Observations of Failures of the Memory Cell in a Deep Trench Capacitor DRAM - The Effect of Tem Specimen Preparation Method on Ultra-thin Gate Dielectric Analysis - Forward Scattered Scanning Electron Microscopy for Semiconductor Metrology and Failure Analysis - Session 7: Failure Analysis Process - Contributions of a Formal Analysis Metaprocess to Breakthrough Failure Analysis Results - SRAM Failure Analysis Strategy - VLSI Design for Functional Failure Analysis in the < 90 nm and Flip-chip era - Identification of an IDDQ Failure Mechanism Using a Variety of Front and Backside Analytical Techniques - Novel Application of Transmission Electron Microscopy and Scanning Capacitance Microscopy for Defect Root Cause Identification and Yield Enhancement - Session 8: Metrology and Materials Analysis 2 - Contact Failure due to Particulate Defect in a 0.13 μm CMOS Process - Microhardness Testing on Via Fill Material for Via In Pad Technology - Application of ToF-SIMS to Airborne Organic Contamination Analysis - Session 9: Test 1 - Yield-Modeling and Test Oriented Taxonomy of IC Structure Deformations - Analysis of IC Manufacturing Process Deformations: An Automated Approach Using SRAM Bit Fail Maps - Electrical Failure Analysis and Characterization of Leakage Paths Leading to Single Cell Failures in 128Mbit SDRAMs - Session 10: Poster - A Study on Fluorine-Induced Corrosion on Microchip Aluminum Bondpads - Advanced Process Defect Detection by Using Dynamic Bias Condition and MCT Camera - Via Chain Failure Analysis Using a Combination of E-Beam and Optical Beam Techniques - ESD Failure Signature Differences in the Devices Core Logic and Protection Structures -- A Case Study - ESD: Correlation between Electrical Signature and Failure Modes - Semi-Automated Cross-Section Process for Complti-Face Perimeter Samples - FIB Micro-pillar sampling of Si devices and its 3D observation - Recent Developments in Automated Sample Preparation for FESEM - Wet Delineation of SEM Samples having Cu Interconnects - An Evolution in Plastic Decapsulation Process Improvement - Near IR Continuous Wavelength Spectroscopy of Photon Emissions from Semiconductor Devices - Defect Isolation and Characterization in Contacts by Using Primary Voltage Adjustment"

"In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and overcomes some significant problems encountered with alternative resolution enhancing schemes"

"Contents :- Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors - Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation - Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis - Measurement of Interfacial Adhesion and Its Degradation in Multi-Layer Packages, Devices, And Blanket Films Using the Laser Spallation Technique - New FIB-Supported Approach for Wirebond Characterization - Failure Analysis of Flip Chip Bumps after Thermal Stressing - X-Ray Tomography for Electronic Packages - Data Analysis Tools and Methodologies for Quick Yield Learning in a High Volume Manufacturing Environment - Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication - Embedded Memory Analysis for Standard Cell ASIC Yield Enhancement - Yield Enhancement Study: Process Variation and Design Margins Leading to Timing Issues in RAM - In-line Defect to Bitmap Signature Correlation: A Shortcut to Physical FA Results - Analysis of Leakage Failures in Flash Memory Devices and Root Cause Identification - Passive Voltage Contrast Application on Analysis of Gate Oxide Failure in 0.25 μm Technology - Forensic Microscopy in the Failure Analysis Laboratory - Failure Analysis Process Flow and Common Failure Mechanisms in Flip-Chip Packaged Devices - A Study on the Yield Loss Due to Al (Cu) Interconnections with Spacing Failure - Near IR Absorption in Heavily Doped Silicon–An Empirical Approach - Embedded SRAM Bitmapping and Failure Analysis for Manufacturing Yield Improvement - LSI Process Diagnosis for Device Users - Application of KOH Electrochemical Etch and Passive Voltage Contrast Techniques to Identify Leaky Gate in Deep Submicron CMOS - UV Reflectance Spectroscopy of the Copper/Copper Oxide System for Assessment of Solderability - Antireflection Coatings for Semiconductor Failure Analysis - Comparative Study of Sample Preparation Techniques for Backside Analysis - A Comparison of Backside Emission Microscopy Systems - Failure Analysis from the Back Side of a Die - ESD Effects on Electromigration Performance of Aluminum Metallization System - Evaluation of On-Chip ESD Supply Clamp Robustness by In-situ Floating Power Bus Monitoring - Transmission Line Pulse Testing of the ESD Protection Structures of ICs.-A Failure Analysts Perspective - Failure Analysis of CDM ESD Damage in a GaAs RFIC - A Focused Ion Beam Technique to Electrically Contact the Deep Trench Capacitor of a Single Active Memory Cell in the Sub 0.25 μm Technology Regime - The Use of TMAH to Etch Silicon and Expose Metal Bridging Failures - Selective Au Etching in Au/Al Bonds in Current IC Technology - A Novel Method to Analyze the Deep Trench Capacitors in DRAM - Identification and Analysis of Parasitic Depletion Mode Leakage in a Memory Select Transistor - Thermal Fatigue Induced Voiding in LDMOS Transistors Submitted to Multiple Energy Discharges - Humidity-Bias Driven Shorts in Multilayer Circuits: A Case Study in Failure Analysis - Passivation Cracks in a Four-Level Metal Low-k Dielectric Backend Process - Electronic Package Failure Analysis Using TDR - Time Domain Reflectometry as a Device Packaging Level Failure Analysis and Failure Localization Tool - Contrast Inversions in Scanning Acoustic Microscopy (C-SAM) of Glue Die Attach - Application of Scanning Acoustic Microscopy tom Electric and Electronic Parts - Combining FIB Sequential Cross-Sectioning With TEM for Small Defect Analysis in SRAM Array - Failure Analysis of Tungsten Stud Defects from the CMP Process - Integrated Circuit SNR Improvement using Dielectric Altering Compound, Laser Trim, and FIB system - Characterization and Isolation Techniques in Silicon on Insulator Technology Microprocessor Designs - Failure Analysis of Stacked-Chip Scale Package - Reducing Top-of-Die Plastic Delamination by Assuring Pre-Mold Cleanliness of Die Surfaces - SMT Ceramic Capacitor Failure Mechanisms, Isolation Tools, Techniques and Analysis Methods - Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects - Failure Analysis and Elimination of Galvanic Corrosion on Bondpads During Wafer Sawing - High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities - Semiconductor Wear Out at Nuclear Power Plants - UTC Clinic Hospital Network: Description of International Network of Failure Analysis Labs and Case Studies - Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on- Index"

"Contents - IPFA 2000 Best Paper Award Winner - Application of Focused Ion Beam System as a Defect Localization and Root Cause Analysis Tool - Session 1: Advanced Techniques 1 - X-Ray Tomography of Integrated Circuit Interconnects: Past and Future - X-ray Nanotomog Raphy (XRMT) Tool for Non-Destructive High-Resolution Imaging of ICs - Single Point PICA Probing with an Avalanche Photo-Diode - Session 2: Advanced Techniques 2 - Comparison of Laser and Emission Based Optical Probe Techniques - Resistive Interconnection Localization - Optical Waveform Probing–Strategies for Non-Flipchip Devices and Other Applications - Advanced LIVA/TIVA Techniques - Session 3: Packaging - Super-conducting Quantum Interference Device Technique: 3-D Localization of a Short Within a Flip Chip Assembly - Integration of SQUID Microscopy into FA Flow - Evaluation of alternative Preparation Methods for Failure Analysis at modern Chip-and Package Technologies - TDR Analysis of Advanced Microprocessors - Signal Trace and Power Plane Shorts Fault Isolation Using TDR - Session 4: Poster Session - Backside Etch: A New FA Technique for Gate Oxide Pinhole and Si Defect Identification for Power IC Devices - Fabrication Of Inexpensive Decapsulation Fixtures for Small or Unique Plastic Packages - Failure Analysis of Plasma-Induced Submicron CMOS IC Yield Loss by Backside Photoemission Microscopy - Failure Types & Analysis In Cu Process Development of Design-Rule 0.18 μm CPU - TEM Examination of a Specified Site Identified by X-SEM in Microelectronics Failure Analysis - Design Debug and Design Fix Verification in a Failure Analysis Lab for a RF/IF Circuit for Cellular Applications With High Battery Save and Electrostatic Discharge Leakage: A Case Study - Self Aligned Contact Wordline-Bitline Shorts in Memory ICs–a Comparative Study of a Failure Mode, Its Root Causes, And Simple, But Highly Effective Analysis Techniques - A Spatial Filtering Localisation Tool for Failure Analysis of Periodic Circuits - New Manifestation of Electrical Overstress in Advanced Device Technologies - Session 5: Backside 1 - Implementing Thermal Laser Stimulation in a Failure Analysis Laboratory - Calibration Technique for MCT FPA used for Backside Emission Microsopy - Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors - New Signal Detection Methods for Thermal Beam Induced Phenomenon - CNC Milling and Polishing Techniques for Backside Sample Preparation - Session 6: SPM - Characterization of MOS Devices by Scanning Thermal Microscopy (SThM) - Contactless Failure Analysis of Integrated Circuits Via Current Contrast Imaging with Magnetic Force Microscopy - Multiple Probe Deep Sub-Micron Electrical Measurements Using Leading Edge Micro-Machined Scanning Probes - Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects - Session 7: Backside 2 - Emission Microscopy and Thermal Laser Stimulation for Backside Failure Localization - CMOS Front-End Investigation over Large Areas by Deprocessing from the Back Side - New Techniques for the Identification of Defects in Multi-Layer Flip-Chip Packages - Session 8: Case Histories 1 - Board Level Failure Analysis of Chip Scale Packages - IC Failure by Electrical Overstress (EOS) - The Search for the Elusive EOS Monster - Session 9: FIB - Effect of Ga Staining due to FIB Editing on IR Imaging of Flip Chips - Water Vapor Enhancement for Elemental Analysis Using Focused Ion Beam Secondary Ion Mass Spectrometry (FIB-SIMS) - Various Focused Ion Beam Microsurgery Techniques in Dealing with Copper Metalization in ICs - Reliability of Bipolar and MOS Circuits After FIB Modification - Mass Production Cross-Section Tem Samples by Focus Ion Beam Masking and Reactive Ion Etching - Session 10: Case Histories 2 - A Successful Failure Analysis Using Front and Backside Fault Localization Techniques on a Deep Sub-Micron CMOS Device - Use of STEM in Nanometer Level Defect Analysis of SRAM Devices - A New Deprocessing Technique By Selective Wet-Etch Of Passivation And Inter Metal Dielectric Layers For Submicron Devices - SRAM Failure Analysis Flow - Physical Failure Analysis on Vertical Dielectric Films - Session 11: MEMS - Design for Reliability of MEMS/MOEMS for Lightwave Telecommunications - Mechanical Characterization of Materials Used in MEMS - Optical Imaging of High-Frequency Resonances and Semi-Static Deformations in Micro-Elec"

"This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results."

"Contents :- Testing-Based Failure Analysis: A Critical Component of the SIA Roadmap Vision - Experimental Figures for the Defect Coverage of IDDQVectors - A CAD-Based Approach to Failure Diagnosis of CMOSLSI with Single Fault Using Abnormal IDDQ - Test and Failure Analysis Implications of a Novel Inter-Bit Dependency in a Non- Volatile Memory - Analysis of a Latent Deep Submicron CMOS Device Isolation Leakage Mechanism - Scanning Fluorescent Microthermal Imaging - Temperature Profiling with Highest Spatial and Temperature Resolution by Means of Scanning Thermal Microscopy (SThM) - Thermal and Optical Enhancements to Liquid Crystal Hot Spot Detection Methods - Application of Backside Photo and Thermal Emission Microscopy Techniques to Advanced Memory Devices - A New Chemical Method of Wright Etch in the Delineation of Stacking Faults and Crystalline Defects in Fabrication Silicon Wafer Substrate - Cross Sectioning with a Pivoting Sample Block - Gain Reduction in Silicon Phototransistors Induced by Metallization Mask Misalignment - The Identification of Thermal Fatigue Testing Method of Soldered Joints for Space Use - Comparison Precision XTEM Specimen Preparation Techniques for Semiconductor Failure Analysis - Temperature-Dependent Electronic Circuit Analogy for Predicting Wire Temperature as a Function of Current - The Application of FIB Voltage-Contrast Technique Combining with TEM on Subtle Defect Analysis: Via Delamination After TC - The Usage of Focused Ion Beam Induced Deposition of Gold Film in IC Device Modification and Repair - Failure Analysis Challenges of Surface Micromachined Accelerometers - Failure Analysis for Micro-Electrical-Mechanical Systems (MEMS) - Investigation of Multi-Level Metallization ULSls by Light Emission from the Back- Side and Front-Side of the Chip - A Simple, Cost Effective, and Very Sensitive Alternative for Photon Emission Spectroscopy - Novel Failure Analysis Technique - An Application of Breakthrough Failure Analysis Techniques in Eliminating Silicon Dislocation Problem in Sub-Micron CMOS Devices - Characterization of Californium-252 (252 Cf) as a Laboratory Source of Radiation for Testing and Analysis of Semiconductor Devices - Dendritic Growth Failure of a Mesa Diode - Application of Laser Scanning Microscope to Analyze Forward Voltage Snapback of Compound Semiconductors - Interpretation of Sudden Failures in Pump Laser Diodes - Through-Transmission Acoustic Inspection of Ball Grid Array (BGA) Packages - Moisture Detection Method in Ceramic Package by Slight Current Measurement - Laser Microchemical Technology: New Tools for Flip-Chip Debug and Failure Analysis - Single Contact Electron Beam Induced Current Microscopy for Failure Analysis of Integrated Circuits - Electrical and Chemical Characterization of FIB-Deposited Insulators - IC Design Modification Using Laser Assisted Organometal Deposition - Transmission Electron Microscopy (TEM) Specimen Preparation Technique Using Focused Ion Beam (FIB): Application to Material Characterization of Chemical Vapor Deposition of Tungsten (W) and Tungsten Silicides (Wsix) - Automatic Fault Tracing Using an E-Beam Tester With Reference to a Good Sample - The Business Aspects of Failure Analysis - A Process Induced Failure Mechanism in the EEPROM Cell Its Identification and Solution - Failure Isolation of Mobile Ions Using Secondary Ion Mass Spectroscopy - Detection of Gate Oxide Defects Using Electrochemical Wet Etching in KOH: H20 Solution - Spin-On-Glass (SOG) Contamination Causing Single Via Failure - Use of Failure Analysis Techniques to Optimize the Passivation Process for a TLM 0.35 um Process - Effectiveness of Emission Microscopy in the Failure Analysis of CMOS ASIC Devices - Elimination of Whisker Growth on Tin Plated Electrodes - Characterization of CMOS Structures (0.6 um process) Submitted to HBM and COM ESO Stress Tests - BiCMOS Die Sort Yield Improvement from Isolation of a Localized Defect Mechanism and Precision TEM Cross Section - SEM Equipment Capabilities Evaluated for Sub-Half Micron Semiconductor Applications - Voltage Contrast Application on 1M SRAM Single Bit Failure Analysis - Index "

"Contents :- IPFA 2002 Best Paper Award Winner - SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of Electronic Devices - From Microns to Molecules–Can FA Remain Viable Through the Next Decade? - Soft Defect Localization (SDL) on ICs - Fault Localization and Functional Testing of ICs by Lock-in Thermography - Visualisation of Electrically Active Areas Using Electron Holography - A Study of Photoelectron Emission Microscopy Contrast Mechanisms Relevant to Microelectronics - Application of Acoustic Fourier Domain Imaging for the Evaluation of Advanced Micro Electronic Packages - Orientation Imaging Microscopy Applications in Cu-Interconnects and Cu-Cu Wire Bonding - Materials Analysis and Process Monitoring in MegaFabs - STEM (Scanning Transmission Electron Microscopy) in a SEM (Scanning Electron Microscope) for Failure Analysis and Metrology - Microcalorimeter Energy Dispersive X-Ray Spectroscopy in Routine Semiconductor Failure Analysis - A Working Method for Adapting the (SEM) Scanning Electron Microscope to Produce (STEM) Scanning Transmission Electron Microscope Images - Applications of EELS to Semiconductor Devices Failure Analysis by Using a 300 keV TEM - Laser Milling Methods for Package Failure Analysis - Laser Decapsulation of Transfer Molded Plastic Packages for Failure Analysis - Investigation of Microstructure Change on Ni-based UBM Systems in Lead Free Solder - Failure Analysis Strategy For 2 Stacked Die CSP - Evaluation of Package Defects by Thermal Imaging Techniques - Backside Hot Spot Detection - Optimizing Backside Image Quality - Infrared Microthermography for Integrated Circuit Fault Location; Sensitivity and Limitations - Failure Analysis of Tungsten Contact Failure in a 0.13 um CMOS Process - Backside Photoemission and Infrared Microthermography for Rapid Debug of Compound Semiconductor Devices - Laser-Voltage-Prober Measurements on Bipolar Devices - Application of Focused Ion Beam in Debug and Characterization of 0.13 um Copper Interconnect Technology - Thin-Die Flip Chip Physical-FA Process Flow - Failure Mechanism and Rootcause Analysis of UBGA Solder Ball Contamination - Passivation Damage and Residue-Induced Package Failure Analysis For a 16 Lead SOIC GaAs RF/IF Package - Study on a Single NFET Degradation After Circuit Modification with FIB - New Techniques to Improve the Efficiency of TEM Sample Preparation - A Transmission X-Ray Microscope (TXM) for Non-Destructive 3D Imaging of ICs at Sub-100 nm Resolution - A Broadband Model for Ultrasonic Pulses in the Presence of Thin Layers in Microelectronics - Beam-Based Localization Techniques for 0.18 um IC Failure Analysis after Reliability Test - Methodologies for Isolating Faults in Multi Chip Fiber Optic Transceivers that Use GHz Mixed Signal ICs - Application of Various Fault Localization Techniques to Different Types of 6T- SRAM column Failures - Missing Metal Pillar Failure Analysis-A Plug Technology Issue - Reliability and failure analysis of RF MEMS switches - Failure Analysis of Polysilicon Micromirror Arrays - Failure Analysis of the Digital Micromirror Device - Wavefront Coded Imaging Systems for MEMS Analysis - Sample preparation for Vertical Transistors in DRAM - A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB - CMOS Backside Deprocessing With TMAH/IPA as a Sample Preparation Procedure for Failure Analysis - Investigation of Choline Hydroxide for Selective Silicon Etch from a Gate Oxide Failure Analysis Standpoint - In situ Decapsulation of Plastic Encapsulated Devices Mounted to a Printed Circuit Board - A Standardized Scientific Method Formulation for Failure Analysis Application - Probeless FA Approach: a Breakthrough Simulation Based Failure Analysis Method - Electrical Faults Captured by In-Line E-beam Inspection and Failure Analysis - Effect of Corner Underfill Voids on Chip Scale Package (CSP) Performance Under Mechanical Loading - Leakage Isolation of Mixed-Signal Devices at Operating Modes - Method for Measuring Package to Board Interconnection Shear Strength for Area Array, Fine Pitch Packages - Picosecond Imaging Circuit Analysis of Leakage Currents in CMOS Circuits - Scanning SQUID Microscopy for Die Level Fault Isolation - A Successful Failure Localization Approach for Defect Identification on High Resistance Interconnects - Backside FIB Device Modifications Through the BOX Layer of an SOI Device - Coax"

"This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results."

"Contents :- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging Techniques in CMOS Failure Analysis - Infrared Light Emission From Semiconductor Devices - The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI Circuits - Golden Devices II: Alchemy in the 0.35 um Era - Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip - Two Unique Case Studies Performed With Photoemission Microscopy (PEM) - Application of Photoemission Microscopy and Focused Ion Beam Microsurgery to an Investigation of Latchup - Localizing Heat-Generating Defects Using Fluorescent Microthermal Imaging - A User-Friendly System for Fluorescent Microthermal Imaging and Light Emission Microscopy - Fast, Clean and Low Damage Deprocessing Using Inductively Coupled and RIE Plasmas - X-Ray Microfocus Radioscopy and Computed Tomography for Failure Analysis - Low Resistivity FIB Depositions Within High Aspect Ratio Holes - Grains Observation Using FIB Anisotropic Etch Followed by AFM Imaging - Cross-Sectional Specimen Preparation of Fragile Failure Location in Thin-Film Transistors Using Focused Ion Beam Etching and Transmission Electron Microscope - Low Acceleration Voltage EBIC Using FESEM and Application to Cross- Sectional Junction Evaluation - Contamination Diagnosis Using Contamination-Defect-Fault (CDF) Simulation - FLOSPAT: Fault Localization by Sensitized Path Transformation - Fault Verification Simulation for Light-Emission Microscopy and Liquid-Crystal Analysis - Fault Diagnosis on the TMS320C80 (MVP) Using FastScanTM - Modeling IC Defects Using Circuit Simulation Software - Characterization of Unfilled Tungsten Plugs on a 0.35 um CMOS Multilevel Metallization Process - Failure Analysis of a Half-Micron CMOS IC Technology - Burn-in Failure Analysis of 0.5 um 1 MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug - The Application of Novel Failure Analysis Techniques and Defect Modeling in Eliminating Short Poly End-Cap Problem in Submicron CMOS Devices - Case Study: Unique Stress Induced Gate Oxide Defects in a CMOS Analog/Digital Device Revealed by Backside Silicon Removal - Risk Assessment in Signature Analysis - Signature Analysis: Statistical Models and Their Application to FA - A Signature Analysis Method for IC Failure Analysis - TEM Sample Preparation Using A Focused Ion Beam and A Probe Manipulator - Pin-Point Transmission Electron Microscopic Analysis Applied to Off-Leakage Failures of a Bipolar Transistor in 0.5 um BiCMOS Devices - TEM Cross-Sectional Analysis of ESD Induced Damage in Input Protection Circuitry - A Study of Measurement Methods for Detecting Voiding and Delamination of Die Attach Materials in Power Semiconductor Devices - Failure Analysis of the Die-Attach in a Metal-Type Package - Charge Diffusion and Reciprocity Theorems: A Direct Approach to EBIC of Ridge Laser Diodes - Characterization and Elimination of Forward Snapback Defects in GaAs Light Emitting Diodes - Temperature Dependence of Quiescent Currents as a Defect Prognosticator and Evaluation Tool - Contactless Testing of Pulse Propagation in IC's-A Comparison Between OBIC and Captive-Coupling Detection Techniques - Electron-Beam Analysis of the Turn-On Speed of Grounded-Gate NMOS ESD Protection Transistors During Charged Device-Model Stress Pulses - Contactless Function Test of Integrated Circuits on the Wafer - Package Related Failure Mechanisms in Plastic BGA Packages Used for ASIC Devices - Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy - Signature Analysis of Package Delamination Using Scanning Acoustic Microscope - A Case Study of Post De-Tape Cleans on Mold Compound Adhesion - Spatial Evaluation of Resolution in a Scanning Ultrasonic Microscope. Microassembling Technologies Characterization: Differences Between A-Scan and C-Scan Analysis Modes - Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards - A Review of Wet Etch Formulas for Silicon Semiconductor Failure Analysis 301 Carbon Coating for Electron Beam Testing and Focus Ion Beam Reconfiguration - A Technique for Achieving Precision Cross Sections of Released Surface Micromachined Structures - The Study of ESD Destructive Mechanism for PN-Junction - Interconnect Failure Dependence on Crystallographic Structure - Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures - Mechanism Study of Contact Corrosion in Unpatterned Metal Wafer - TPLY for Yield Improvement - A New Robust Backside Flip-Chip Probing Methodology "